DRAM Device Engineer Intern — AI-Driven Process & Yield

Micron Technology, Inc.; Boise (ID); In loco; USD 18.000 - 23.000; Part-time

Descrizione del lavoro

Micron Technology, Inc. in Boise, Idaho, invites PhD students in Electrical or Materials Engineering to join as a Process Integration and Device Engineering Intern.

You will work with an industry-leading team on cutting-edge DRAM technologies, enabling next-generation memory devices. Responsibilities include supporting module integration, analyzing data for yield improvements, collaborating across YE/Device/PI teams, documenting findings, and presenting updates to leadership.

Competenze

• Strong knowledge of semiconductor devices.
• Advanced CMOS or capacitor knowledge preferred.
• Basic knowledge of memory technologies (DRAM, NAND, NOR).
• Knowledge of statistical data analysis.
• Knowledge of semiconductor process flow; DRAM flow knowledge a plus.
• Good communication skills and self-motivated.
• Able to do 6 months + Intern

Mansioni

• Support integration of process modules across various DRAM module loops.
• Analyze electrical and inline data to identify yield detractors and process anomalies.
• Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement.
• Document findings and present updates to engineering and leadership teams.
• Leveraging AI tool to improve problem solving efficiency and productivity

Conoscenze

Semiconductor devices knowledge

CMOS/capacitor knowledge

DRAM/NAND/NOR memory knowledge

Statistical data analysis

Semiconductor process flow

Communication skills

Internship duration 6+ months

Formazione

PhD student in Electrical Engineering

PhD student in Materials Engineering

Strumenti

AI tool usage

Descrizione del lavoro

Micron Technology, Inc. in Boise, Idaho, invites PhD students in Electrical or Materials Engineering to join as a Process Integration and Device Engineering Intern.

You will work with an industry-leading team on cutting-edge DRAM technologies, enabling next-generation memory devices. Responsibilities include supporting module integration, analyzing data for yield improvements, collaborating across YE/Device/PI teams, documenting findings, and presenting updates to leadership.