Product Marketing Manager – Thermal Control, Semiconductor, AI & Data Center Infrastructure

Phononic Inc; Durham (NC); On-site; USD 85,000 - 115,000; Full time

Job summary

Phononic Inc in Durham, North Carolina is looking for a Product Marketing Manager to lead go-to-market strategies for AI solutions and semiconductor products. This strategic role requires a strong understanding of AI workloads and data center infrastructure.

The successful candidate will translate complex technical concepts into compelling narratives for customers, develop differentiated messaging, and drive product launches. This position favors individuals with at least 5 years of relevant experience in product marketing or technical marketing.

Qualifications

• 5+ years in product marketing, technical marketing, or product management in Semiconductors, AI/ML platforms, Data center infrastructure.
• Strong understanding of AI workloads, compute architectures, and power and thermal constraints.
• Excellent communication and storytelling skills.

Responsibilities

• Develop messaging for thermal control systems for AI products.
• Lead launches of silicon and AI platform solutions in high-density environments.
• Analyze trends in AI infrastructure and data center thermal management.

Skills

Product marketing

Technical marketing

AI workloads understanding

Communication skills

Cross-functional leadership

Education

Bachelor’s degree in Electrical Engineering, Computer Science, Mechanical Engineering, or related field

Job description

Ready to revolutionize AI datacenter thermal control solutions and deployments? Phononic is the place for you. We are seeking a results-oriented individual to join our Infrastructure Solutions organization to deliver industry‑leading innovative products in support of revolutionizing cooling solutions for AI datacenters.

About The Role

We are seeking a strategic and technically sophisticated Product Marketing Manager (PMM) to drive go‑to‑market success for our semiconductor and AI solutions. This role sits at the intersection of compute, AI workloads, and data center infrastructure, with a growing focus on thermal management and cooling technologies required to scale next‑generation AI systems. You will translate complex chip architectures, AI workloads, and power/thermal constraints into compelling value propositions—helping customers understand not just performance, but efficiency, sustainability, and total cost of ownership (TCO) in modern AI data centers.

Key Responsibilities

Product Positioning & Messaging

• Develop differentiated messaging for thermal control systems for AI products (e.g., GPUs, ASICs, AI accelerators, SoCs, CPO, pluggable transceivers)
• Articulate value across performance, power efficiency, and thermal design considerations
• Translate complex concepts such as optical transceiver laser thermal control, AI server and GPU cooling, rack density, cooling requirements, and energy efficiency into customer‑impact narratives

Go‑To‑Market Strategy

• Lead launches of silicon and AI platform solutions optimized for high‑density, thermally constrained environments
• Develop GTM strategies that highlight performance‑per‑watt, cooling efficiency, and infrastructure readiness
• Partner with product and engineering teams on positioning tied to data center scalability and sustainability

Market & Competitive Intelligence

• Analyze trends across AI infrastructure, high‑performance computing (HPC), and data center thermal management
• Track competitive approaches to liquid cooling, immersion cooling, advanced air cooling, and energy‑efficient architectures
• Develop insights on how competitors address heat density, power consumption, and AI cluster scaling challenges

Sales & Partner Enablement

• Equip sales teams with materials explaining thermal tradeoffs, rack‑level constraints, and cooling requirements
• Develop tools to communicate TCO, power usage effectiveness (PUE), and data center operational efficiency
• Collaborate with ecosystem partners including data center operators, cloud providers, and cooling and infrastructure vendors (e.g., liquid cooling solutions)

Content & Thought Leadership

• Create content on AI infrastructure challenges, including power delivery, cooling, and scaling constraints
• Publish whitepapers and technical briefs on AI workload‑driven thermal demands, cooling technologies (liquid cooling, immersion, direct‑to‑chip), sustainable AI infrastructure, etc.
• Represent the company in discussions on AI data center design and efficiency trends

Requirements

Required

• Bachelor’s degree in Electrical Engineering, Computer Science, Mechanical Engineering, or related field (MBA a plus)
• 5+ years in product marketing, technical marketing, or product management in Semiconductors, AI/ML platforms, Data center infrastructure
• Strong understanding of AI workloads (training vs. inference), compute architectures (GPU/CPU/ASIC), and power and thermal constraints in high‑performance systems
• Ability to translate technical topics such as heat dissipation, cooling architectures, and energy efficiency into business value
• Excellent communication and storytelling skills

Preferred

• Experience with AI data center infrastructure, hyperscale environments, or HPC systems
• Knowledge of thermal management and cooling technologies
• Familiarity with infrastructure design tradeoffs for large‑scale AI clusters
• Background working with cloud providers, colocation vendors, or system integrators

Key Skills

• Technical fluency across compute, power, and thermal systems
• Ability to connect silicon innovation with infrastructure constraints
• Strategic positioning in rapidly evolving AI and data center markets
• Cross‑functional leadership across engineering, product, and sales
• Storytelling grounded in performance, efficiency, and sustainability