Process Optimization Intern: Data & Lean Six Sigma

Federal Home Loan Bank of Chicago; Chicago (IL); On-site; USD 39,000 - 58,000; Full time

Benefits offered by this job

401k & Pension

Medical Insurance

Dental Insurance

Vision Insurance

Lifestyle Spending Account

11 Paid Holidays

Job summary

The Federal Home Loan Bank of Chicago is seeking a summer intern for the Process Optimization department. You will support process improvement initiatives, create process flows, collect and analyze data, and develop recommendations with Lean Six Sigma approaches.

Successful candidates are enrolled in a four-year program, maintain a 3.0+ GPA, and study Supply Chain Management, Business Administration, Information Technology, or Engineering. Internship runs May 2027–August 2027 in Chicago.

Qualifications

• Applicants should be enrolled at an accredited four-year institution.
• GPA of at least 3.0 and in good academic standing.
• Desired fields of study include Supply Chain Management, Business Administration, Information Technology, Industrial or Mechanical Engineering or related discipline.

Responsibilities

• Support process optimization initiatives using project management, process standardization, change management, and business analytics.
• Create process flows and business architecture documentation.
• Collect, analyze, and present data relevant to process optimization and operations.
• Develop recommendations based on process data.
• Collaborate with stakeholders to implement solutions.
• Facilitate employee training in Lean Six Sigma methodologies.

Skills

Data analysis

Project management

Lean Six Sigma

Stakeholder collaboration

Education

Enrollment in a four-year program

Job description

The Federal Home Loan Bank of Chicago is seeking a summer intern for the Process Optimization department. You will support process improvement initiatives, create process flows, collect and analyze data, and develop recommendations with Lean Six Sigma approaches.

Successful candidates are enrolled in a four-year program, maintain a 3.0+ GPA, and study Supply Chain Management, Business Administration, Information Technology, or Engineering. Internship runs May 2027–August 2027 in Chicago.