Process Integration & Defect Reduction Engineer

Talanto; Albuquerque, Northern (NM, KY); Hybrid; USD 76,000 - 126,000; Full time

Job summary

New Mexico Silicon Manufacturing (NM Si Mfg) Yield Department seeks Process Integration and Defect Reduction Engineers to optimize interconnect and advanced packaging fabrication for Foveros and EMIB technologies. You will collaborate across yield functions to sustain process health as products scale from development to high-volume manufacturing.

You will design experiments, analyze large data sets, and implement control strategies to improve device performance, reliability, and yield while

Qualifications

• Bachelor’s or Master’s degree in Chemical, Electrical, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics or related field.
• Experience in high-volume semiconductor manufacturing and DOE is preferred.
• Strong problem-solving, data analysis and cross-functional collaboration skills.

Responsibilities

• Develop and execute experiments to optimize semiconductor manufacturing processes.
• Analyze process, defect and yield data to identify trends and improvement opportunities.
• Monitor inline defectivity and end-of-line yield metrics to ensure process stability.
• Lead root-cause investigations and drive corrective actions in manufacturing.

Skills

Creative problem solving

Data analysis

Inline defect detection

Project management

Process control

Cross-functional collaboration

Communication skills

Education

Bachelor’s or Master’s in engineering/related

Tools

JMP

SQL

PCS

Job description

New Mexico Silicon Manufacturing (NM Si Mfg) Yield Department seeks Process Integration and Defect Reduction Engineers to optimize interconnect and advanced packaging fabrication for Foveros and EMIB technologies. You will collaborate across yield functions to sustain process health as products scale from development to high-volume manufacturing.

You will design experiments, analyze large data sets, and implement control strategies to improve device performance, reliability, and yield while