Process Integration, Yield and Defect Reduction Engineering Lead

Intel; Albuquerque (NM); On-site; USD 141,000 - 199,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel's NM Si Manufacturing Integration Team in Albuquerque seeks an engineering leader to grow into a Process Integration Team Lead role. You will guide teams supporting advanced packaging manufacturing, collaborating with HVM engineering and factory operations to transfer, ramp, and sustain technologies.

The ideal candidate will have strong problem-solving skills, influence across organizations, and a passion for enabling technology development in a high-volume environment with a focus on

Qualifications

• Bachelor's or Master's degree in a technical field.
• 5+ years in semiconductor manufacturing or advanced packaging.
• 3+ years applying DOE methodologies.
• 5+ years in data analysis and SPC using JMP/SQL/PCS or similar.

Responsibilities

• Lead technology development, transfer, and ramp activities.
• Collaborate with HVM engineering and factory operations to transfer, ramp, and sustain advanced packaging technologies.
• Drive continuous improvements in yield, quality, reliability, and manufacturing efficiency.

Skills

Leadership

DOE methods

Data analysis

Statistical process control

Project management

Communication

FMEA

Cross-functional collaboration

Education

Engineering degree (Chemical/Electrical/Mechanical/Materials Science/Microelectronics/Chemistry/Physics)

Tools

JMP

SQL

PCS

Job description

Job Details

Job Description

The New Mexico Silicon Manufacturing (NM Si Manufacturing) Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role. This position reports directly to the NM Si Manufacturing Integration Director and offers the opportunity to lead teams of technical contributors supporting Intel's advanced packaging manufacturing operations.

In this role, you will collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. You will play a critical role in ensuring successful execution against foundry customer commitments while driving continuous improvements in yield, quality, reliability, and manufacturing efficiency.

The ideal candidate will have a proven track record of technical leadership, innovation, and cross-functional collaboration. Success in this position requires strong problem-solving skills, the ability to influence across organizations, and a passion for enabling technology development in a high-volume manufacturing environment.

Minimum Qualifications

• Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.
• 5+ years of experience in semiconductor manufacturing or advanced packaging.
• In addition, candidates should possess experience in one or more of the following areas: 5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.
• 3+ years of experience applying Design of Experiments (DOE) methodologies.
• 5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.

Preferred Qualifications

Technical Skills and Experience

• Strong understanding of semiconductor manufacturing process flow and advanced packaging technologies.
• Knowledge of process capability analysis, specification management, statistical variation, and process control methodologies.
• Proven ability to analyze defectivity and parametric data to identify yield limiters and drive process improvements.
• Experience with yield analysis and defect reduction methodologies.
• Experience applying Failure Modes and Effects Analysis (FMEA) techniques.
• Experience developing inline monitoring systems, dashboards, and manufacturing health metrics.

Leadership and Problem Solving

• Demonstrated success leading technology development, transfer, and manufacturing ramp activities.
• Proven ability to solve complex technical challenges using innovative and data-driven approaches.
• Strong project management, communication, and stakeholder management skills.
• Ability to lead cross-functional teams and influence technical decisions across multiple organizations.
• Experience driving operational excellence, yield improvement, and manufacturing efficiency initiatives.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, New Mexico, Albuquerque

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US

$140,830.00-198,820.00 USD

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to