Process Integration Engineer

Absolics Inc; Covington (GA); On-site; USD 100,000 - 150,000; Full time

Job summary

Absolics Inc in Covington, GA is seeking an R&D Engineer – Process Integration to orchestrate and integrate critical process steps in advanced packaging technologies. The role involves managing multi-step process integration, collaborating with various engineering teams, and ensuring high-quality production outcomes. Candidates should have a Ph.D. in relevant fields, with experience in process integration and strong collaborative skills.

The position offers a competitive salary ranging from $100,000 to $150,000, depending on experience.

Qualifications

• Ph.D. in a relevant field preferred; M.S. with relevant experience considered.
• Demonstrated experience in integration of processes from lithography to metallization.
• Ability to collaborate effectively with cross-functional teams.

Responsibilities

• Oversee process integration and manage scheduling.
• Develop and implement integration strategies for efficiency.
• Monitor and analyze process performance for improvements.
• Ensure compliance with industry standards.

Skills

Experience integrating multi-step package build-up process flows

Strong working knowledge across the full unit-process stack

Experience authoring Process Integration Plans

Track record of root-causing yield or reliability excursions

Statistical process control and DOE methodology

Strong cross-functional collaboration skills

Familiarity with metrology and failure analysis techniques

Understanding of registration, overlay, and CD budget allocation

Fluent in English

Education

Ph.D. in Materials Science, Electrical Engineering, or related field

M.S. with 5+ years of relevant process integration experience

Job description

Job Title: R&D Engineer – Process Integration

Location: Covington, GA

Job Type: Full-Time

About Us

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.

Job Description

We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as:

• Dielectric materials selection and application
• Lithography
• Wet & dry clean/etch/develop processes
• PVD and electroplating

into a coherent, manufacturable process flow for fine‑pitch, next‑generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision‑maker to help navigate constraints in the full process flow. You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end‑to‑end flow, while also engaging with device/package design teams on architecture feasibility. In an early‑stage environment, this role carries enormous influence on the finalized architecture and build‑up decisions.

Key Responsibilities

• Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.
• Develop and implement process integration strategies to optimize production yield and efficiency.
• Coordinate with cross‑functional teams to ensure seamless integration of processes.
• Monitor and analyze process performance, identifying areas for improvement.
• Ensure compliance with industry standards and safety regulations.
• Troubleshoot and resolve process‑related issues in a timely manner.
• Maintain detailed documentation of processes and procedures.
• Generate innovative ideas for patent filings.

Required Skills

• Demonstrated experience integrating multi‑step package build‑up process flows (SAP and/or damascene), from lithography through metallization and dielectric build‑up
• Strong working knowledge across the full unit‑process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross‑process interactions and failure handoffs
• Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation
• Track record of root‑causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography‑etch mismatch)
• Statistical process control and DOE methodology for multi‑variable, multi‑step process optimization
• Strong cross‑functional collaboration skills; ability to translate unit‑process engineer findings into integration‑level decisions and vice versa
• Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross‑section, CD‑SEM, overlay metrology, electrical test)
• Understanding of registration, overlay, and CD budget allocation across sequential build‑up layers
• Fluent in English; proficiency in Korean is a plus.

Preferred Skills

• Experience with glass core substrates
• Direct experience scaling fine line/space RDL, including via CD control and multi‑layer registration challenges
• Experience with any next‑gen architecture enablement: glass core/glass interposer integration, panel‑level processing, co‑packaged optics, hybrid bonding, or fan‑out heterogeneous integration
• Familiarity with bifurcated roadmap considerations (high‑performance AI/HPC vs. cost‑optimized mainstream paths) and how that shapes architecture and material tradeoffs
• Experience building DFM (design‑for‑manufacturing) guidelines in collaboration with package design teams
• Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices
• Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel‑level CMP, advanced laser/plasma drill, novel dielectric chemistries)
• Experience presenting integration roadmaps or technical reviews to leadership or cross‑functional stakeholders
• Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration

Education

• Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred
• M.S. with 5+ years of relevant process integration or process engineering experience considered (integration roles typically warrant a higher experience bar than single‑unit‑process roles)

Salary

• $100,000 – $150,000