Process Integration and Applications Engineer

Thintronics®; California (MO); On-site; USD 100,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

401(k)

Paid time off

Stock options grant

Job summary

Thintronics is seeking an experienced process integration and applications engineer to own the integration and optimization of Thintronics materials into customer production flows. You will design DOEs, troubleshoot excursions, and translate fab-floor insights into feedback for R&D teams.

You will serve as the primary technical liaison with substrate manufacturers and OSAT partners, supporting demonstrator builds, qualifications, pilot builds, and production ramp.

Qualifications

• BS, MS, or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or a related field.
• 5+ years of hands-on process engineering experience in semiconductor packaging or substrate fabrication.
• Direct, working-level experience with FCBGA or advanced organic substrate fabrication.
• Demonstrated proficiency in substrate unit processes: lamination, photolithography, dry processes (DRIE, plasma etching, desmear, PVD/sputtering), wet processes (wet etching, electroless deposition), and other metallization techniques.
• Strong analytical skills, with experience designing and executing DOEs and interpreting process data.

Responsibilities

• Development and deployment of Thintronics advanced packaging substrate processes: modified semi-additive, semi-additive, embedded trench, and back-end-of-line (BEOL)
• Process integration of Thintronics dielectric and conductor materials into FCBGA and advanced organic substrate fabrication flowsOwnership of unit process steps, including lamination, photolithography, dry/wet etch, and copper metallization
• Build-up layer process development and optimization for high-density interconnect structures
• Yield analysis, failure analysis, and root-cause investigation to drive continuous process improvement
• Electrical performance and reliability characterization in support of customer qualifications
• Serving as the primary technical liaison between Thintronics R&D and substrate manufacturer/OSAT partners during material qualification and production ramp
• Translating customer process feedback and application requirements into structured technical inputs for internal materials development
• Building and maintaining working-level relationships with process engineers at customer and partner fabs across Asia
• Participating in technical process reviews with leading semiconductor companies

Skills

DOE design and analysis

Process analytics

Cross-cultural collaboration

High-speed signal integrity

Education

BS/MS/PhD in Chemical Engineering, Materials Science, Electrical Engineering

Tools

Lamination

Photolithography

Dry etching (DRIE, plasma etching)

Wet etching

PVD/Sputtering

Electroless deposition

Job description

Thintronics is solving one of the defining challenges in modern computing: moving massive amounts of data and power between chips at unprecedented speeds and densities. As Moore's Law slows, performance is increasingly defined by advanced packaging, chiplets, and high-density substrates. Our materials technology enables new levels of interconnect density, signal integrity, and power delivery inside next-generation semiconductor packages. We partner directly with leading IDMs, foundries, substrate manufacturers, and OSATs building the most advanced AI and HPC platforms in the world.

About the Role

This is a hands-on process integration and applications engineering role for engineers who are equally comfortable on the substrate manufacturer and OSAT floor and in customer technical reviews. You will own the integration and optimization of Thintronics materials into customer production flows — designing DOEs, troubleshooting process excursions, and translating fab-floor findings into actionable feedback for the R&D teams (Chemistry, Materials Science, and Materials Analytics). You will also serve as a primary technical interface between Thintronics and its substrate manufacturer and OSAT partners, supporting customer demonstrator builds, qualifications, pilot builds, and production ramp activities. This role requires frequent travel between the U.S. and substrate manufacturers and OSATs in Asia (Japan, Taiwan, and Korea); candidates should expect an average of 25–30% international travel on a recurring basis.

Responsibilities

• Development and deployment of Thintronics advanced packaging substrate processes: modified semi-additive, semi-additive, embedded trench, and back-end-of-line (BEOL)
• Process integration of Thintronics dielectric and conductor materials into FCBGA and advanced organic substrate fabrication flowsOwnership of unit process steps, including lamination, photolithography, dry/wet etch, and copper metallization
• Build-up layer process development and optimization for high-density interconnect structures
• Yield analysis, failure analysis, and root-cause investigation to drive continuous process improvement
• Electrical performance and reliability characterization in support of customer qualifications
• Serving as the primary technical liaison between Thintronics R&D and substrate manufacturer/OSAT partners during material qualification and production ramp
• Translating customer process feedback and application requirements into structured technical inputs for internal materials development
• Building and maintaining working-level relationships with process engineers at customer and partner fabs across Asia
• Participating in technical process reviews with leading semiconductor companies

Qualifications

• BS, MS, or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or a related field
• 5+ years of hands-on process engineering experience in semiconductor packaging or substrate fabrication
• Direct, working-level experience with FCBGA or advanced organic substrate fabrication
• Demonstrated proficiency in substrate unit processes: lamination, photolithography, dry processes (DRIE, plasma etching, desmear, PVD/sputtering), wet processes (wet etching, electroless deposition), and other metallization techniques
• Strong analytical skills, with experience designing and executing DOEs and interpreting process data

Required Skills

• ABF substrate fabrication and high-density build-up layer process experience
• Experience with chiplet integration or 2.5D/3D packaging architectures
• Background in high-speed signal integrity, reliability testing, or qualification programs
• Experience working directly with engineering teams at Asia-based substrate manufacturers, and comfort navigating cross-cultural technical environments
• Prior experience at Tier-1 substrate manufacturer or OSAT with one or more areas of competency: FCBGA substrate, Wafer-Level or Panel-Level Fanout, Interposer (such as CoWos, iTHOP)

Compensation

Thintronics offers a competitive base salary commensurate with experience and qualifications, with clear opportunities for growth through promotion as the company scales. In addition to base salary, this role includes a grant of qualified stock options subject to standard vesting schedules.

The base salary range for this position is $100,000–$160,000 per year. Actual compensation will depend on the candidate's experience, skills, and qualifications.

Benefits

• This role also includes eligibility for Thintronics' benefits package, including medical, dental, and vision insurance, 401(k), and paid time off.

Travel & Work Requirements

• Regional travel: This role requires approximately 25–30% regional travel to customer sites and partner fabs across Japan, Taiwan, and South Korea.
• Travel eligibility: Candidates must be able to obtain and maintain valid passports, visas, and all required travel documents for business travel in the relevant countries.
• Work authorization: U.S.-based candidates must have authorization to work in the U.S. at the time of hire. Thintronics does not provide work visa sponsorship for this position.
• Mobility: Ability to work effectively across multiple time zones and to travel on short notice as business priorities require.

Thintronics is an equal opportunity employer. We do not discriminate on the basis of race, color, religion, sex, national origin, age, disability, veteran status, or any other characteristic protected by applicable law.