Process Engineering Intern - R&D for Wafer Tech (Hybrid)

Lam Research

Fremont (CA)

On-site

USD 62,000 - 84,000

Full time

14 days+

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Job summary

Lam Research is seeking a Summer 2027 Process Engineering Intern (BS). You will support process development, equipment setup, and testing for Lam's WFE tools in the Customer Support Business Group.

You’ll set up processing equipment, conduct technical tests, analyze results, and present findings to help optimize yield. Ideal candidates are currently enrolled in an engineering or science BS program and can work a shift schedule.

Qualifications

  • Foundational communication skills, reading and writing in English.
  • Ability to work a shift schedule.
  • Enrollment in a BS program in engineering or sciences (chemical, physics, chemistry, materials, electrical, mechanical).

Responsibilities

  • Supports Process Engineers in wafer fabrication equipment tests, setup, experiments, data collection, and sample submissions.
  • Operates processing equipment and advanced tools with engineering-defined recipes to collect results and analyze measurements.
  • Prepares charts and records of results for presentation to identify yield improvement opportunities.
  • Provides technical assistance to process development teams and engineers.
  • Assists in troubleshooting and improving application lab tools and experiments setups.
  • Performs other duties as assigned based on project needs.

Skills

Foundational communication skills
Reading and writing in English
Shift schedule availability

Education

BS in engineering or science major

Job description

Lam Research is seeking a Summer 2027 Process Engineering Intern (BS). You will support process development, equipment setup, and testing for Lam's WFE tools in the Customer Support Business Group.

You’ll set up processing equipment, conduct technical tests, analyze results, and present findings to help optimize yield. Ideal candidates are currently enrolled in an engineering or science BS program and can work a shift schedule.

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