Process Engineering Intern: 3D Wafer Electrodeposition

LAM RESEARCH Corporation

Tualatin (OR)

Hybrid

USD 90,000 - 120,000

Full time

14 days+

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Benefits offered by this job

On-site Flex

Virtual Flex

Hybrid work model

Job summary

Lam Research is pursuing cutting-edge Sabre 3D process development to advance wafer fab electrodeposition technology. You will join the WETS group and contribute to developing features on the Sabre 3D system, testing formulations, and supporting reactor performance through bench-scale experiments and materials analysis.

The role emphasizes hands-on lab work, data gathering, and collaboration with a high-energy team tackling complex electrochemical plating challenges.

Qualifications

Experience in wet laboratory settings.
Experience with troubleshooting complex equipment and systems.
Knowledge in electrochemistry, copper/tin/tin-alloys, nickel electrodeposition.
Experience with modeling and simulation techniques supporting process understanding.
Solid understanding of grain growth and microstructure evolution in plated films.
Hands-on electroplating process development, including bath chemistry and additives.

Responsibilities

Set up and run bench-scale experiments for deposition development.
Operate application lab deposition development tools and analyze chemistry/materials.
Perform metrology to measure on-wafer deposition performance.
Contribute to data compilation and literature research for project support.