Process Engineer II - Plasma Etch & Wafer Processing

Leonardo DRS; Dallas (TX); Sur place; USD 90 000 - 120 000; Plein temps

Avantages offerts par ce poste

Health insurance

401(k) savings plan

9/80 schedule

Résumé du poste

Leonardo DRS in Dallas, TX is seeking a Process Engineer for the Focal Plane Array team to drive development activities in plasma etch, improve manufacturability, and enhance yield. You will support front end wafer processing, optimize deposition and etching across multiple tools, and contribute to metrology-driven process control.

Ideal candidates bring hands-on plasma etch tool experience, semiconductor fundamentals, and the ability to document plans and results.

Qualifications

• U.S. Citizenship is required.
• Bachelor's Degree in Materials Engineering, Manufacturing Engineering, or related field such as Materials Science, Chemistry, or Physics.
• Experience: 2+ years.
• Hands on experience using, troubleshooting, and maintaining Plasma etch tools.
• Strong foundation in semiconductors and solid state physics.
• Experience with a variety of plasma etch systems and processes.
• Strong understanding of complementing metrology tools.
• Willingness to spend extended periods in manufacturing areas or cleanrooms.

Responsabilités

• Provide process engineering support to the front end wafer processing team, including vacuum tool support for deposition and dry etching.
• Improve manufacturing processes to optimize yield, increase capacity, and reduce cycle time.
• Troubleshoot and diagnose problems with existing products and implement improvements.
• Establish and maintain metrics to validate material quality at various stages of the process flow.
• Analyze and disposition non-conforming material or processes.
• Design, develop, and document new or improved processes and equipment.
• Coordinate technical activities and progress reports with management and peers.
• Lead and complete projects on schedule and budget.

Connaissances

Semiconductors

Solid state physics

Documentation & reporting

Formation

Bachelor's Degree in Materials/Manufacturing Engineering or related field

Outils

Plasma etch tools

DOE

SPC

DMAIC

Description du poste

Leonardo DRS in Dallas, TX is seeking a Process Engineer for the Focal Plane Array team to drive development activities in plasma etch, improve manufacturability, and enhance yield. You will support front end wafer processing, optimize deposition and etching across multiple tools, and contribute to metrology-driven process control.

Ideal candidates bring hands-on plasma etch tool experience, semiconductor fundamentals, and the ability to document plans and results.