Process Engineer - Copper Electroplating

ProFound People; Phoenix (AZ); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Equity opportunities

401k match

Job summary

ProFound People is seeking a Process Engineer for Copper Electroplating to scale lab processes into robust manufacturing workflows for advanced semiconductor technologies. You will drive copper deposition processes and collaborate with R&D and manufacturing teams to ensure repeatable results.

The role requires hands-on electroplating expertise, a strong background in semiconductor fabrication, and experience supporting technology transfer to pilot lines and external partners.

Qualifications

• Degree in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering
• 5+ years of hands-on experience in electroplating or electrochemical process development
• Support process transfer to pilot lines and external fabrication partners
• Strong experience with copper electroplating or similar metal deposition systems
• Background in semiconductor manufacturing, advanced packaging
• Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments

Responsibilities

• Translate lab-scale processes into stable, repeatable manufacturing workflows
• Support process transfer to pilot lines and external fabrication partners

Skills

Copper electroplating

Electrochemical process development

Semiconductor manufacturing

Process transfer to pilot lines

OSAT/FEOL/BEOL plating knowledge

Education

Degree in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering

Tools

Copper plating equipment

Metal deposition systems

Job description

Process Engineer - Copper Electroplating

Strong Salary + Equity opportunities + 401k match

This is an incredible opportunity to work on cutting-edge technology which is changing the semiconductor industry.

This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies.

This company is creating a new fabrication process which can improve the compute ability of chips considerably.

After receiving strong funding and HUGE amounts of industry interest, they are adding to their R&D function in the form of a Process Engineer for Copper Plating.

Translating lab-scale processes into stable, repeatable manufacturing workflows is critical for this opportunity.

Some requirements & additional info.

Degree in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering

5+ years of hands‑on experience in electroplating or electrochemical process development

Support process transfer to pilot lines and external fabrication partners

Strong experience with copper electroplating or similar metal deposition systems

Background in semiconductor manufacturing, advanced packaging.

Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments