Principal Silicon Tech Architect — Hybrid Role

AMD

United States

Hybrid

USD 180,000 - 260,000

Full time

14 days+
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Benefits offered by this job

AMD benefits

Job summary

AMD is seeking a Principal Engineer to serve as a technical authority across the full lifecycle of FPGA and ASIC solutions. This role involves advanced silicon technology evaluation, design enablement, process development, and manufacturing bring-up from concept to high-volume production.

The ideal candidate will understand manufacturing processes, device physics, reliability, and have experience with FPGA/ASIC development, IP validation, and collaboration with foundries and packaging vendors.

Qualifications

  • Bachelor's degree in engineering or physical science; advanced degree preferred.
  • Strong analytical and problem-solving abilities with excellent communication.
  • Experience in FPGA/ASIC product development and NPI is desired.

Responsibilities

  • Evaluate technology and enable design for FPGA/ASIC products in advanced nodes.
  • Analyze product WAT, performance correlation, and yield during NPI with foundry/design teams.
  • Coordinate testchip design and tapeout for process/IP validation prior to NPI.
  • Collaborate with design, CAD & PDK teams to deliver robust IP and product designs.
  • Support silicon technology roadmap exploration to meet customer requirements.

Skills

Analytical thinking
Problem solving
Communication
Leadership
Cross-functional collaboration

Education

Bachelor's degree in engineering or physical science
MS or PhD preferred

Tools

EDA tools

Job description

AMD is seeking a Principal Engineer to serve as a technical authority across the full lifecycle of FPGA and ASIC solutions. This role involves advanced silicon technology evaluation, design enablement, process development, and manufacturing bring-up from concept to high-volume production.

The ideal candidate will understand manufacturing processes, device physics, reliability, and have experience with FPGA/ASIC development, IP validation, and collaboration with foundries and packaging vendors.

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