Principal RF Packaging Engineer – 3D/SiP

Skyworks Solutions, Inc.; Richardson (TX); On-site; USD 123,000 - 255,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking a Principal Research Scientist to lead RF packaging and heterogeneous integration research in a high-impact environment. The role focuses on 3DHI, SiP, and WLP technologies to enable next-generation radar, communications, and wireless systems.

You will drive concept development, architecture, and collaborations across disciplines. The ideal candidate will hold a Ph.D., have 8+ years of research experience, and show a proven record of innovation, with strong

Qualifications

• Ph.D. or equivalent in a related field.
• Experience leading research programs from concept to transition.
• Strong publication and patent track record.

Responsibilities

• Lead research and technology development in advanced packaging and 3D integration.
• Develop architectures for RF SiP/WLP and heterogeneous integration.
• Define technology roadmaps and collaborate with cross-functional teams.
• Lead externally funded programs and coordinate with partners.

Skills

Technical leadership

Project management

Communication

Team collaboration

Innovation

Education

Ph.D. in Electrical Engineering

Job description

Skyworks Solutions, Inc. is seeking a Principal Research Scientist to lead RF packaging and heterogeneous integration research in a high-impact environment. The role focuses on 3DHI, SiP, and WLP technologies to enable next-generation radar, communications, and wireless systems.

You will drive concept development, architecture, and collaborations across disciplines. The ideal candidate will hold a Ph.D., have 8+ years of research experience, and show a proven record of innovation, with strong