Principal Mechanical Design Engineer: Thermal & Packaging

Qorvo, Inc.; Richardson (TX); On-site; USD 120,000 - 150,000; Full time

Job summary

Qorvo, Inc. is seeking a Principal Mechanical Design Engineer to join their Defense & Aerospace team in Richardson, Texas. This role involves leading mechanical design for electronics packaging aimed at defense communication systems. The candidate will leverage significant experience in semiconductor packaging, collaborating with IC designers and engineering teams.

Applicants should possess a BSME/MSME degree and at least 12 years of relevant experience. Skills in ANSYS and Solidworks are critical, along with expertise in microelectronic assembly processes.

Qualifications

• Minimum of 12 years’ experience in semiconductor packaging.
• Experience in the design of packaged microelectronic assemblies for defense, avionics, aerospace, or automotive industries.
• Expert level skill with ANSYS and Solidworks, or similar.

Responsibilities

• Lead mechanical design and analysis efforts of electronics packaging for defense applications.
• Develop next generation microelectronic packaging technology with emphasis on structural analysis.
• Guide package and substrate design decisions to meet performance specifications.

Skills

Mechanical engineering

Structural analysis

ANSYS

Solidworks

Interpersonal communication

Education

BSME/MSME degree in mechanical engineering or relevant field

Tools

FEA tools

Microelectronic inspection tools

Job description

Qorvo, Inc. is seeking a Principal Mechanical Design Engineer to join their Defense & Aerospace team in Richardson, Texas. This role involves leading mechanical design for electronics packaging aimed at defense communication systems. The candidate will leverage significant experience in semiconductor packaging, collaborating with IC designers and engineering teams.

Applicants should possess a BSME/MSME degree and at least 12 years of relevant experience. Skills in ANSYS and Solidworks are critical, along with expertise in microelectronic assembly processes.