Director of AI Photonics Packaging

Neurophos

Austin (TX)

On-site

USD 130,000 - 160,000

Full time

14 days+
Application generator

Don’t send a generic resume — generate a resume and cover letter tailored to this exact role.

Get past ATS filters

Benefits offered by this job

Competitive compensation
Opportunities for personal and professional growth
Collaborative and innovative work environment

Job summary

A leading AI hardware startup in Austin is seeking a Head of AI Photonics Packaging to lead a team in developing cutting-edge solutions. The role involves overseeing the entire lifecycle from design to high-volume manufacturing and collaborating with various teams to push innovative packaging methods. Candidates should have a Master's or Ph.D. and 10+ years in semiconductor packaging with strong communication skills. Competitive compensation and opportunities for growth are offered.

Qualifications

  • 10+ years of hands-on experience in semiconductor packaging technology development.
  • Proven track record of developing CoWoS or similar integration technologies.
  • Strong communication skills for engaging with internal teams and external partners.

Responsibilities

  • Build, lead, and mentor a high-performing team of packaging engineers.
  • Drive the development of advanced packaging processes.
  • Collaborate with cross-functional teams to design package architectures.

Skills

Semiconductor packaging technology development
Advanced packaging methods (flip-chip, wafer-level)
High-speed interconnects
Signal integrity and interconnect techniques
Thermal, mechanical, electrical/optical modeling tools (e.g., ANSYS)

Education

Advanced degree in Electrical Engineering, Mechanical Engineering, Materials Science, Applied Physics

Job description

A leading AI hardware startup in Austin is seeking a Head of AI Photonics Packaging to lead a team in developing cutting-edge solutions. The role involves overseeing the entire lifecycle from design to high-volume manufacturing and collaborating with various teams to push innovative packaging methods. Candidates should have a Master's or Ph.D. and 10+ years in semiconductor packaging with strong communication skills. Competitive compensation and opportunities for growth are offered.
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Head of AI Photonics Packaging
Head of AI Photonics Packaging

Neurophos • Austin (TX)

On-site
USD 130,000 - 160,000
Competitive compensation
Opportunities for personal and professional growth
Collaborative and innovative work environment
Principal Advanced Packaging Engineer - Photonics for AI
Principal Advanced Packaging Engineer - Photonics for AI

Astera Labs • San Jose (CA)

On-site
USD 205,000 - 255,000
Discretionary bonus
Benefits package
Senior Packaging Architect — Photonics for AI HPC
Senior Packaging Architect — Photonics for AI HPC

Socket.dev • Mountain View (CA)

Hybrid
USD 218,000 - 317,000
Health care
Retirement match
Life insurance
+7
Senior Packaging Architect — 3D Photonics for AI HPC (Hybrid)
Senior Packaging Architect — 3D Photonics for AI HPC (Hybrid)

Lightmatter • Mountain View (CA)

Hybrid
USD 218,000 - 317,000
Health Care Plan (Medical, Dental &amp
Retirement Savings Matching
Equity grants
+1
Senior Director Photonic Packaging & High-Speed Integration
Senior Director Photonic Packaging & High-Speed Integration

SBT • San Francisco (CA)

On-site
USD 180,000 - 280,000
Head of Packaging (CPO)
Head of Packaging (CPO)

SBT • San Francisco (CA)

On-site
USD 180,000 - 280,000
Co-Packaged Optics Engineer for AI Data Centers
Co-Packaged Optics Engineer for AI Data Centers

ViaPhoton • Chicago (IL)

On-site
USD 80,000 - 150,000
401(k) with 4% match
Flexible PTO
Health, dental, and vision coverage (1
Principal Analog Design Engineer - Photonics AI Hardware
Principal Analog Design Engineer - Photonics AI Hardware

Neurophos • Austin (TX)

On-site
USD 180,000 - 260,000
100% coverage of health plan premiums
Unlimited PTO
401(k) matching
+2
Senior IC Package FEA Engineer for High-Speed Photonics
Senior IC Package FEA Engineer for High-Speed Photonics

Lumilens • San Jose (CA)

On-site
USD 120,000 - 150,000
Lead Silicon Photonics Engineer - AI Acceleration
Lead Silicon Photonics Engineer - AI Acceleration

Neurophos • Austin (TX)

On-site
USD 120,000 - 150,000
100% coverage of health plan premiums
Unlimited PTO
401(k) matching