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Benefits offered by this job
Competitive compensation
Opportunities for personal and professional growth
Collaborative and innovative work environment
Job summary
A leading AI hardware startup in Austin is seeking a Head of AI Photonics Packaging to lead a team in developing cutting-edge solutions. The role involves overseeing the entire lifecycle from design to high-volume manufacturing and collaborating with various teams to push innovative packaging methods. Candidates should have a Master's or Ph.D. and 10+ years in semiconductor packaging with strong communication skills. Competitive compensation and opportunities for growth are offered.
Qualifications
10+ years of hands-on experience in semiconductor packaging technology development.
Proven track record of developing CoWoS or similar integration technologies.
Strong communication skills for engaging with internal teams and external partners.
Responsibilities
Build, lead, and mentor a high-performing team of packaging engineers.
Drive the development of advanced packaging processes.
Collaborate with cross-functional teams to design package architectures.
A leading AI hardware startup in Austin is seeking a Head of AI Photonics Packaging to lead a team in developing cutting-edge solutions. The role involves overseeing the entire lifecycle from design to high-volume manufacturing and collaborating with various teams to push innovative packaging methods. Candidates should have a Master's or Ph.D. and 10+ years in semiconductor packaging with strong communication skills. Competitive compensation and opportunities for growth are offered.