Precision Wire Bonding Technician — Semiconductor Assembly

Microchip Technology Inc; Princeton Village (MA); On-site; USD 31,684 - 48,216; Full time

Job summary

Microchip Technology Inc. is seeking a skilled Manufacturing Technician specializing in wire bonding to support semiconductor device fabrication and microelectronics assembly.

The role requires translating product requirements into optimized process setups and working with wire bonders to meet tight production targets. The ideal candidate will have 2–5 years in semiconductor manufacturing, certification from a Vocational program, and strong attention to detail with excellent manual dexterity.

Qualifications

• Trade school or vocational certification in electronics or manufacturing.
• 2–5 years hands‑on semiconductor/microelectronics manufacturing.
• Translate product requirements into optimized process setups.
• Strong attention to detail and manual dexterity.
• Read schematics and engineering drawings.
• Proficient computer skills to access drawings and work instructions.

Responsibilities

• Perform component wire bonding for RF transistor packaged devices using automatic and semi-automatic wire bonders; conduct bond pull testing to verify bond integrity
• Set up, calibrate, and operate multiple wire bonding and test systems concurrently, managing workflow to meet production targets and product specifications
• Interpret engineering drawings, build sheets, and process documentation to accurately execute manufacturing tasks
• Execute production work with a high level of precision, maintaining consistent quality and throughput
• Independently adjust equipment and process parameters, including loop height and bond placement, to optimize performance and product quality
• Collaborate with test technicians and engineering personnel to refine wire bonding processes and establish optimal operating conditions
• Perform rework, repair, and modification of assemblies, including solder component removal and replacement
• Troubleshoot production and equipment issues, documenting and escalating as needed to support timely resolution and continuous process improvement
• Maintain accurate production records and ensure compliance with quality and manufacturing standards

Skills

Wire bonding

Schematic reading

Attention to detail

Independent work

Computer literacy

Manual dexterity

Education

Trade/vocational certification in electronics/manufacturing

Tools

Wire bonders

Test systems

Job description

Microchip Technology Inc. is seeking a skilled Manufacturing Technician specializing in wire bonding to support semiconductor device fabrication and microelectronics assembly.

The role requires translating product requirements into optimized process setups and working with wire bonders to meet tight production targets. The ideal candidate will have 2–5 years in semiconductor manufacturing, certification from a Vocational program, and strong attention to detail with excellent manual dexterity.