Wire Bond Technician

Promex Industries Inc.; Santa Clara (CA); On-site; USD 55,000 - 85,000; Full time

Job summary

Promex Industries Inc. in Silicon Valley is seeking a Wire Bond Technician to set up, operate, and monitor automated and manual bond equipment for Au ball, Al wedge, and ribbon bonds.

Based on-site in Santa Clara, you will inspect bonded devices with microscopes, document results, follow process instructions, and contribute to continuous improvement in yield and reliability. The role requires steady hands, attention to detail, and experience with electronics manufacturing environments.

Qualifications

• Ability to read and follow work instructions and process specifications.
• Experience with cleanroom/high-reliability manufacturing environments is beneficial.
• Familiarity with ESD controls and safe handling practices.

Responsibilities

• Set up, operate, and monitor wire bond equipment for Au ball, Al wedge and ribbon bonds.
• Inspect bonded devices using microscopes and metrology tools, verify bond quality.
• Document results and maintain accurate records per quality and regulatory standards.
• Collaborate with engineering and production teams to support prototypes and volume manufacturing.

Skills

ESD awareness

Fine motor skills

Microscope inspection

Hand tools

Wiring / cabling

Reading drawings

Attention to detail

Tools

Wire bond equipment (ball)

Wire bond equipment (wedge)

Wire bond equipment (ribbon)

Job description

Company Description

Promex Industries Inc., based in Silicon Valley, is an ISO 13485:2016 and ISO 9001:2015 certified contract manufacturer specializing in high‑reliability microelectronics assembly for medical, bioscience, commercial, and military applications. The company provides end‑to‑end solutions, supporting customers from early prototypes and new product introductions through to volume manufacturing. Promex operates state‑of‑the‑art facilities, including Class 100 and 1000 cleanrooms, RoHS‑optimized SMT lines, and advanced capabilities for wafer dicing, backgrinding, die attach, flip chip, and wire bonding. By integrating SMT/PCBA with advanced microelectronics assembly, Promex ensures precision, quality, and comprehensive process capabilities across the entire product lifecycle. The team is dedicated to delivering innovative, high‑quality solutions that address the complex challenges of advanced microelectronics devices.

Role Description

The Wire Bond Technician is a full‑time, on‑site role based in Santa Clara, CA, responsible for performing wire bonding operations in support of advanced microelectronics assembly. This role involves setting up, operating, and monitoring automated and manual wire bond equipment for Au ball, Al wedge, and ribbon bonding, following detailed process instructions and production schedules. The technician inspects bonded devices using microscopes and metrology tools, verifies bond quality, and documents results in accordance with quality and regulatory standards. Day‑to‑day tasks include handling wafers and substrates, performing basic equipment maintenance, troubleshooting process issues, and collaborating with engineering and production teams to support prototypes and volume manufacturing. The Wire Bond Technician also contributes to continuous improvement initiatives by identifying opportunities to enhance process efficiency, yield, and reliability.

Qualifications

• Ability to work with cables and cabling in precision electronic assemblies; familiarity with routing and securing fine wires and interconnects.
• Understanding of basic electricity principles relevant to microelectronics and wire bonding processes, including ESD awareness and safe handling practices.
• Proficiency with hand tools used in electronics manufacturing, such as tweezers, cutters, torque tools, and inspection instruments.
• Experience with structured cabling or organized interconnect systems, ensuring neat, reliable, and repeatable assembly practices.
• Hands‑on experience with wire bond equipment (ball, wedge, ribbon) and related microelectronics assembly tools is strongly preferred.
• Prior work in cleanroom or high‑reliability manufacturing environments (medical, aerospace, defense, or similar) is beneficial.
• Ability to read and follow work instructions, assembly drawings, and process specifications with strong attention to detail.
• Comfort with microscope‑based work, fine motor skills, and steady hand‑eye coordination for precision bonding