Precision Wire Bonding Technician for Advanced Tech

Teledyne Scientific & Imaging; Camarillo (CA); On-site; USD 44,500 - 59,300; Full time

Benefits offered by this job

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

401(k) with Company Match

Employee Stock Purchase Plan

Educational Tuition Reimbursement

Paid Vacation, Sick Time and Holidays

Job summary

Teledyne Technologies Incorporated is seeking a Wire Bonding Technician in Camarillo, CA to perform wire bonding of Focal Plane Arrays and silicon readout devices and to inspect parts per QA requirements. You will follow bonding diagrams and procedures, with frequent use of ERP for data tracking and reporting.

Qualified candidates have experience with manual ball and wedge bonding, automatic wire bonders, and can work under a microscope with good hand-eye coordination. U.S.

Qualifications

• Experience with manual ball and wedge bonding and automatic wire bonders.
• Ability to work under a microscope with good hand-eye coordination.
• Familiarity with electrostatic discharge (ESD) controls.
• High School Diploma or equivalent with 3–5 years experience or an associate’s degree with 0–2 years experience.
• U.S. Citizenship required.

Responsibilities

• Perform wire bonding of Focal Plane Arrays (FPA) and silicon readout devices.
• Inspect and evaluate parts in accordance with Quality Assurance requirements.
• Accurately follow established procedures and bonding diagrams.
• Frequently work with Enterprise Resource Planning (ERP) system for tracking and reporting of data.

Skills

Wire bonding

Ball bonding

Wedge bonding

Automatic wire bonding

Hand-eye coordination

ESD controls

ERP system usage

Education

High School Diploma or equivalent

Associate's degree

Tools

ERP system

Job description

Teledyne Technologies Incorporated is seeking a Wire Bonding Technician in Camarillo, CA to perform wire bonding of Focal Plane Arrays and silicon readout devices and to inspect parts per QA requirements. You will follow bonding diagrams and procedures, with frequent use of ERP for data tracking and reporting.

Qualified candidates have experience with manual ball and wedge bonding, automatic wire bonders, and can work under a microscope with good hand-eye coordination. U.S.