Precision Photo & Metrology Equipment Engineer

NXP Semiconductors; Chandler (AZ); On-site; USD 90,000 - 135,000; Full time

Job summary

NXP Semiconductors is seeking an Equipment Engineer for the ECHO Fab in Chandler, AZ. You will own multiple processes and tools, reduce variation, and lead sustaining and improving activities in a high-volume manufacturing environment.

The role requires a technical degree and experience with semiconductor equipment, SPC/FDC excursions, and cross-functional collaboration to drive tool availability and throughput.

Qualifications

• Bachelor’s degree or higher in a technical discipline is required.
• Experience in Photo, Metrology or Plating tools preferred.
• Semiconductor manufacturing experience in process or equipment engineering is preferred.
• Ability to interpret equipment performance data and craft action plans.

Responsibilities

• Own multiple processes and tools in a high-volume fab.
• Identify and reduce sources of variation; implement zero-defect processes.
• Lead sustaining activities: troubleshooting, inventory, supplier coordination, SPC/FDC response.
• Drive continuous improvement: hardware/software upgrades and corrective actions.
• Expand capability: improve throughput, tool availability, and sourcing for parts/services.

Skills

Equipment knowledge

Safety & compliance

Root cause analysis

FDC advanced analytics

MES familiarity

5S & standard work

Vendor/partner mgmt

Communication skills

Problem solving

Bias for action

Education

Bachelor's degree in technical discipline

Tools

MES familiarity

FMEA/DFMEA facilitation

Tool qualification procedures

Job description

NXP Semiconductors is seeking an Equipment Engineer for the ECHO Fab in Chandler, AZ. You will own multiple processes and tools, reduce variation, and lead sustaining and improving activities in a high-volume manufacturing environment.

The role requires a technical degree and experience with semiconductor equipment, SPC/FDC excursions, and cross-functional collaboration to drive tool availability and throughput.