Precision Microelectronics Assembler - Level 2

Honeywell Aerospace US LLC in; Lansdale (Montgomery County); On-site; USD 52,000 - 76,000; Full time

Benefits offered by this job

Health insurance

401(k) plan

Job summary

Honeywell Lansdale is seeking a Micro Electronics Assembler - Level 2 to join a high-tech aerospace team. You will build, refine, inspect, and verify first-piece builds with focus on microscopic precision using epoxy and solder under a microscope.

The role requires 1 year of electronics assembly and wire bonding experience, ability to read technical drawings, and eligibility to obtain a security clearance. Excellent cross-training opportunities and strong benefits accompany the position.

Qualifications

• 1 year of experience as an electronic assembler.
• 1 year of experience wire bonding - thermosonic, thermocompression and ball bonding.
• Able to read prints, parts lists, process sheets/route cards and technical drawings (ECOs).
• Able to use hand tools.
• Able to use measurement tools (scales, calibrated eyepieces, calipers).
• US export control compliance: candidate must be a U.S. person per U.S. law.
• Ability to obtain and maintain a security clearance.

Responsibilities

• Build, modify, rework, and repair electrical components and subassemblies using schematics and process sheets.
• Inspect and rework to ensure quality and reliability of builds.
• Verify producibility during initial assembly to support smooth production flow.
• Cross-train across other assembly roles to support team flexibility.
• Perform precision die-attach using epoxy and solder under a microscope.

Skills

Electronic assembler

Wire bonding

Print & drawings interpretation

Measurement tools

Hand tools

Security clearance

Tools

Automatic wire bonding

Automatic ball/wedge bonding

Job description

Honeywell Lansdale is seeking a Micro Electronics Assembler - Level 2 to join a high-tech aerospace team. You will build, refine, inspect, and verify first-piece builds with focus on microscopic precision using epoxy and solder under a microscope.

The role requires 1 year of electronics assembly and wire bonding experience, ability to read technical drawings, and eligibility to obtain a security clearance. Excellent cross-training opportunities and strong benefits accompany the position.