Postdoctoral Fellow — Semiconductor Bonding Metrology

Johns Hopkins University; Gaithersburg (MD); On-site; USD 70,000 - 89,000; Full time

Job summary

The Chronicle Of Higher Education, Inc. is seeking a PREP Research Associate in Gaithersburg, Maryland. This role involves designing and implementing test methods for evaluating chip bonding quality, requiring a PhD in a relevant field. Additional qualifications include experience with wafer bonding processes and proficiency in finite element modeling tools like COMSOL and ANSYS. The salary ranges from $70,000 to $89,000, with attractive total rewards. This position promises a collaborative environment supporting semiconductor advanced packaging.

Qualifications

• PhD in a related field is required.
• Experience with wafer/hybrid chip bonding processes crucial.
• Desirable skills include infrared microscopy and optical measurements.

Responsibilities

• Design and model test methods for bond quality evaluation.
• Coordinate with teams for materials characterization.
• Implement bond strength testing at varying temperatures.

Skills

Finite element modeling

CAD proficiency

Programming languages

Communication skills

Experience with wafer bonding

Destructive test methods

Infrared microscopy

Education

PhD in mechanical engineering, physics, electrical engineering, materials science, or a related field

Tools

COMSOL

ANSYS

SolidWorks

Autodesk

Python

Java

Matlab

Job description

The Chronicle Of Higher Education, Inc. is seeking a PREP Research Associate in Gaithersburg, Maryland. This role involves designing and implementing test methods for evaluating chip bonding quality, requiring a PhD in a relevant field. Additional qualifications include experience with wafer bonding processes and proficiency in finite element modeling tools like COMSOL and ANSYS. The salary ranges from $70,000 to $89,000, with attractive total rewards. This position promises a collaborative environment supporting semiconductor advanced packaging.