Postdoctoral Fellow (PREP0004199)

Johns Hopkins University; Baltimore (MD); On-site; USD 80,000 - 100,000; Full time

Job summary

Johns Hopkins University is seeking a PREP Research Associate to lead metrology development in rheology and thermal analysis for polymeric and composite materials. Candidates should have a Ph.D. in a related field and expertise in rheology and thermal analysis. The role requires strong quantitative skills in Matlab and Python, along with a track record in technical writing.

This position supports high-level research with a focus on producing industry-relevant metrics and standards. Applicants must be able to work on-site in Gaithersburg, MD, and meet safety requirements.

Qualifications

• Ph.D. in polymer science, materials science, chemical engineering, or a related discipline.
• Expertise in rheology, including orthogonal superposition rheology and large amplitude oscillatory shear rheology.
• Experience with thermal analysis methods including DSC and others.
• Solid background in cure kinetics, chemorheology, and polymer physics.
• Experience with additive manufacturing techniques.
• Strong quantitative/data skills for processing large datasets.

Responsibilities

• Design and execute rheological characterization of complex fluids.
• Lead thermal and thermomechanical characterization activities.
• Characterize reactive/curing systems and build structure-property insights.
• Author publications and present research findings.
• Mentor students and coordinate cross-functional collaborations.

Skills

Rheology expertise

Thermal analysis

Quantitative/data skills (Matlab, Python)

Technical writing

Education

Ph.D. in polymer science or related discipline

Tools

Matlab

Python

Origin

JMP

Job description

PREP Research Associate – CHIPS Funded Project

The National Institute of Standards and Technology (NIST) Professional Research Experience Program (PREP) is seeking a Materials Scientist to lead metrology development in rheology, thermal analysis, and structure-property relationships for complex polymeric and composite materials. The position will support a CHIPS-funded collaboration with an academic institution, conducting high-level, independent research and translating cutting‑edge measurements into industry‑relevant metrics, reference methods, and standards.

• Design and execute rheological characterization of complex fluids and soft solids.
• Lead thermal and thermomechanical characterization.
• Characterize and model reactive/curing systems.
• Build structure-property insights through multimodal characterization.
• Author publications and present research to stakeholders.

U.S. Citizen Preferred.

Qualifications

• Ph.D. in polymer science, materials science, chemical engineering, or a related discipline.
• Expertise in rheology, including orthogonal superposition rheology and large amplitude oscillatory shear rheology.
• Experience with thermal analysis (DSC and at least one of DMA, TGA, TMA, CTE, or thermal conductivity methods), including calibration and validation.
• Solid background in cure kinetics, chemorheology, and polymer physics.
• Experience with additive manufacturing (extrusion‑based and vat photopolymerization).
• Strong quantitative/data skills (Matlab, Python, Origin, JMP) for processing large datasets, fitting models, and producing publication-quality figures.
• Track record of technical writing (peer-reviewed papers, technical reports, SOPs) and communicating results to mixed audiences.
• Demonstrated ability to lead projects, mentor students/postdocs, and coordinate cross‑functional collaborations.
• Ability to work on‑site in a laboratory setting in Gaithersburg, MD and meet all safety/training requirements.

Application Materials

Applicants should submit a CV/resume (maximum 3 pages, valid email address only) and the following additional items: self‑portrait, phone number, home address/country, citizenship status, languages spoken, and sex/gender.

Salary Range

The referenced salary range represents the minimum and maximum salaries for this position and is based on Johns Hopkins University’s good faith belief at the time of posting. The actual compensation may vary based on geographic location, skills, work experience, internal equity, and market conditions.

Equal Opportunity Employer

The United States government is an equal opportunity employer. We do not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity, veteran status, or any other legally protected characteristic.