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Johns Hopkins University is hiring a PREP Research Associate for a one-year appointment to collaborate on the CHIPS project in Gaithersburg, MD. The role involves developing advanced microscopy techniques to measure mechanical properties for semiconductor packaging.
Candidates must hold a Ph.D. and possess a strong background in scattering techniques, data analysis, and technical writing. The position is on-site in Gaithersburg.
This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. It supports a one-year appointment to collaborate with academic researchers on the CHIPS project, focusing on accurate cure kinetics, stress, mechanical properties, and warpage measurements for next‑generation microelectronics packaging under device‑relevant conditions.
Location: Gaithersburg, MD (on‑site laboratory)
Key Responsibilities:
Qualifications:
Position Description: The Intelligent Systems Division at NIST investigates the performance of 3D machine‑vision systems for various manufacturing applications. This role focuses on integrating 3D bin‑picking vision systems with robotic arms and conducting experiments to evaluate performance, supporting the development of new metrics and standards.
Location: Gaithersburg, MD (on‑campus, full‑time 40 hrs/wk)
Key Duties:
Salary Range: The referenced minimum to maximum salary is provided by Johns Hopkins University, subject to qualifications, location, experience, and other factors.
Benefits: Johns Hopkins offers a total rewards package supporting health, life, career and retirement. For more information, see https://hr.jhu.edu/benefits-worklife/.
Equal Opportunity Employer: The Johns Hopkins University is committed to equal opportunity for faculty, staff, and students. The university does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status or other legally protected characteristics.