Plasma Etch Execution Engineer — 300mm Yield

Texas Instruments Incorporated; Sherman (TX); On-site; USD 85,000 - 120,000; Full time

Job summary

Texas Instruments Incorporated is seeking Execution Process Engineers to advance state-of-the-art 300mm semiconductor manufacturing. You will lead quality event management, drive process stability, and implement improvements across OOC/OOS lots, cycle times, and SMA initiatives.

The role emphasizes hands-on SPC, data analysis, and cross-functional collaboration to ensure high yields and robust processes in a complex manufacturing environment. TI values teamwork and continuous learning.

Qualifications

• 2+ years relevant Process Engineering experience
• Bachelor's degree in a technical field as listed
• Strong foundation in statistical process control, engineering change control and process release strategies
• Ability to work 12 hour compressed shift or 1st shift for onboarding

Responsibilities

• Lead Quality Event Management: identify and resolve quality excursions, determine root causes, contain/dispositioned material.
• Enable Flawless Execution: develop and execute strategies for OOC/OOS lots and YE down dispositions.
• Drive Process Stability: own SPC and improve inline performance; identify chamber/tool matching for best-in-class Cpk and %OOC.
• Operational Improvements: maximize installed capacity, reduce cycle time, implement SMA and reduce WIP wait times.
• Training and Development: train Process Engineering Technicians and create tools for team efficiency

Skills

Statistical Process Control

Quality Event Management

Process Improvement

Cross-functional Collaboration

Data Analysis

Education

Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics

Job description

Texas Instruments Incorporated is seeking Execution Process Engineers to advance state-of-the-art 300mm semiconductor manufacturing. You will lead quality event management, drive process stability, and implement improvements across OOC/OOS lots, cycle times, and SMA initiatives.

The role emphasizes hands-on SPC, data analysis, and cross-functional collaboration to ensure high yields and robust processes in a complex manufacturing environment. TI values teamwork and continuous learning.