Senior Engineer, Advanced DRAM & Memory Tech

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Job summary

Micron Technology in Boise, Idaho is seeking a Sr Engineer to advance DRAM research and development. The role focuses on bridging device physics and materials science to define future memory technologies, including layered memory devices and novel architectures.

You will lead tech integration, design experiments, collaborate across functions, and drive project milestones from concept to silicon, delivering reliable memory solutions for high-performance computing and AI workloads.

Qualifications

• MS or PhD in Physics, Materials Science, Electrical Engineering, or related field.
• 10+ years of semiconductor process integration or advanced node development experience.
• Strong knowledge of semiconductor device physics and meticulous DOE-based experiment design.
• Proven experience leading multi-functional technical teams and managing complex projects.

Responsibilities

• Lead technology integration to enable new layered memory devices (charge storage, TFTs).
• Develop and integrate device architectures from concept to silicon productization.
• Optimize process flows and drive product performance and reliability.
• Plan and execute experiments in the R&D fab with cross-functional teams.
• Analyze inline, defect, and parametric data to understand failures and improve yield.
• Present complex results clearly to technical and non-technical audiences.

Skills

Device physics

DOE design

Lead teams

Education

MS/PhD in Physics/MSE/EE

Job description

Micron Technology in Boise, Idaho is seeking a Sr Engineer to advance DRAM research and development. The role focuses on bridging device physics and materials science to define future memory technologies, including layered memory devices and novel architectures.

You will lead tech integration, design experiments, collaborate across functions, and drive project milestones from concept to silicon, delivering reliable memory solutions for high-performance computing and AI workloads.