PhD Software Research Intern: TCAD & Simulation

Intel Corporation

Hillsboro (OR)

On-site

USD 150,000 - 151,000

Full time

5 days ago

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Job summary

Intel Corporation in Hillsboro, Oregon is offering a Software Research Intern (PhD) role within the TCAD Process Reliability Modeling team. You will contribute to advanced computational software for semiconductor technology development, including chip-package interactions, thermal transport, thin films, and patterning.

This internship targets PhD students applying software engineering and research to real engineering challenges.

Qualifications

Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
Must have a minimum GPA of 3.0 in college courses to date.
1+ year programming experience in C/C++/Python or equivalent.
Strong analytical, problem-solving, and software development skills.

Responsibilities

Design, develop, and optimize software solutions for engineering and research applications.
Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques.
Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.
Establish criteria and methods to determine proper inputs and validate results.
Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
Document technical solutions and present findings to project stakeholders.