Software Engineering - PhD Intern

Intel Corporation; Hillsboro (OR); On-site; USD 150,000 - 151,000; Full time

Job summary

Intel Corporation在俄勒冈州希尔斯堡区提供一个面向博士生的软件研究实习机会，加入TCAD过程可靠性建模团队。实习生将参与前沿计算软件、仿真与建模方法的开发，覆盖芯片封装耦合、热传导与热管理、薄膜沉积与图案化等领域。

该职位面向电气、材料、机械、化学等相关领域的博士生，需具备扎实的编程能力（C/C++/Python）及分析问题的能力，能在跨学科团队中开展研究工作，发表技术成果并交付可扩展的解决方案。

Qualifications

• Must be a full-time student pursuing a Ph.D. in a semiconductor-related field.
• Minimum 3.0 GPA in college courses to date.
• 1+ year experience programming in C/C++/Python or equivalent.

Responsibilities

• Design, develop, and optimize software solutions for engineering and research applications.
• Develop simulations capabilities using numerical methods (finite element, level sets, etc.).
• Develop modeling-based methodologies to solve device and interconnect process and reliability problems.
• Document solutions and present findings to project stakeholders.

Skills

C/C++/Python

Analytical skills

Problem solving

Education

PhD in Electrical, Materials, ME or Chemical Engineering

Tools

TCAD tools

Finite element solvers

Job description

Job Details:Job Description:The Role and ImpactIntel is seeking a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. This internship offers an opportunity to work on advanced computational software solutions supporting semiconductor technology development. The selected candidate will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport and thermal management, thin films development and patterning.The internship is designed for PhD students interested in applying software engineering and research expertise to solve complex engineering challenges while collaborating with multidisciplinary teams across Intel.Business GroupThe Intel Foundry Technology organization is focused on driving semiconductor process innovation and enabling future technology nodes. Within the LTD-TD TCAD team, engineers and researchers develop advanced simulation, modeling, and software solutions used to accelerate technology development. The team fosters a collaborative environment where software, mathematics, physics, and engineering intersect to solve challenging technical problems.Key ResponsibilitiesDesign, develop, and optimize software solutions for engineering and research applications.Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques.Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.Establish criteria and methods to determine proper inputs and validate results.Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.Document technical solutions and present findings to project stakeholders.Qualifications:Minimum QualificationsMust be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.Must have a minimum of a 3.0 GPA in college courses to date.1+ year experience programming in C/C++/Python or equivalent.Strong analytical, problem-solving, and software development skills.Preferred Qualification sExperience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance.Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems.Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices.This is your opportunity to develop your expertise, gain hands-on experience, and make a meaningful impact within a collaborative environment that drives the future of technology. We look forward to seeing how your skills and passion will contribute to our innovative team.Job Type:Student / InternShift:Shift 1 (United States of America)Primary Location:US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .Annual Salary Range for jobs which could be performed in the US: $149,598.00-149,602.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.