Software Engineering PhD Intern New 2027

Intel Corporation; Hillsboro (OR); On-site; USD 150,000 - 151,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon is offering a Software Research Intern (PhD) role within the TCAD Process Reliability Modeling team. You will contribute to advanced computational software for semiconductor technology development, including chip-package interactions, thermal transport, thin films, and patterning.

This internship targets PhD students applying software engineering and research to real engineering challenges.

Qualifications

• Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
• Must have a minimum GPA of 3.0 in college courses to date.
• 1+ year programming experience in C/C++/Python or equivalent.
• Strong analytical, problem-solving, and software development skills.

Responsibilities

• Design, develop, and optimize software solutions for engineering and research applications.
• Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques.
• Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.
• Establish criteria and methods to determine proper inputs and validate results.
• Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
• Document technical solutions and present findings to project stakeholders.

Skills

C/C++/Python programming

Analytical thinking

Software development

Education

PhD in Electrical Engineering, Materials Science, Mechanical Eng, Chemical Eng or semiconductor field

Tools

TCAD tools

Finite element solvers

Atomistic simulation tools

Job description

Job Details: Job Description: The Role and Impact Intel is seeking a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. This internship offers an opportunity to work on advanced computational software solutions supporting semiconductor technology development. The selected candidate will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport and thermal management, thin films development and patterning. The internship is designed for PhD students interested in applying software engineering and research expertise to solve complex engineering challenges while collaborating with multidisciplinary teams across Intel.

Business Group The Intel Foundry Technology organization is focused on driving semiconductor process innovation and enabling future technology nodes. Within the LTD-TD TCAD team, engineers and researchers develop advanced simulation, modeling, and software solutions used to accelerate technology development. The team fosters a collaborative environment where software, mathematics, physics, and engineering intersect to solve challenging technical problems.

Key Responsibilities

• Design, develop, and optimize software solutions for engineering and research applications.
• Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques.
• Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems.
• Establish criteria and methods to determine proper inputs and validate results.
• Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
• Document technical solutions and present findings to project stakeholders.

Qualifications

Minimum Qualifications

• Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field.
• Must have a minimum of a 3.0 GPA in college courses to date.
• 1+ year experience programming in C/C++/Python or equivalent.
• Strong analytical, problem-solving, and software development skills.

Preferred Qualifications

• Experience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance.
• Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems.
• Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices.

Job Type: Student / Intern

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $149,598.00-149,602.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.

Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during your hiring process, please report this immediately to your recruiter.