PhD Module Engineering Intern: Materials & Packaging Tech

Intel Corporation; Chandler (AZ); On-site; USD 121,000 - 122,000; Full time

Job summary

Intel Corporation's Materials Technology Development is seeking a Summer Intern for 2027 in Assembly Technology Development. You will engage in fundamental research, characterizing materials and failure modes, and helping assess material feasibility for product applications.

As a Module Engineering – Graduate Intern, you will collaborate with suppliers, understand Intel's assembly processes, and contribute to next-generation packaging platform technologies by designing processes and equipment

Qualifications

• Pursuing a full-time Ph.D. in one of the listed disciplines.
• 6+ months to 1+ year of relevant research experience.

Responsibilities

• Characterize materials and identify potential failure modes.
• Collaborate with suppliers to develop material formulations.
• Develop understanding of assembly processes and material interactions.
• Support implementation of material technologies on test vehicles and products.
• Design and develop assembly processes and equipment for next-generation packaging technologies.

Skills

Fundamental research

Communication skills

Team collaboration

Fast learning

Education

Ph.D. in Materials Science & Engineering

Ph.D. in Chemical Engineering

Ph.D. in Chemistry

Ph.D. in Polymer Science/Polymer Chemistry

Ph.D. in Metallurgy/related fields

Job description

Intel Corporation's Materials Technology Development is seeking a Summer Intern for 2027 in Assembly Technology Development. You will engage in fundamental research, characterizing materials and failure modes, and helping assess material feasibility for product applications.

As a Module Engineering – Graduate Intern, you will collaborate with suppliers, understand Intel's assembly processes, and contribute to next-generation packaging platform technologies by designing processes and equipment