PCBA Senior NPI Engineer

FII; San Jose (CA); On-site; USD 100,000 - 110,000; Full time

Job summary

FII is seeking a Senior NPI / Process Engineer in San Jose, California. In this full-time role, you will serve as the Subject Matter Expert (SME) for PCB manufacturing and electronic assembly processes, guiding engineering teams to enhance efficiency and product quality. Candidates should hold a Bachelor's degree in Engineering, possess 7-10 years of relevant experience, and have strong knowledge of manufacturing processes. The position offers a salary range of $100k - $110k/year and is onsite only.

Qualifications

• Minimum 7-10 years’ experience in electronics manufacturing or process engineering.
• Strong knowledge of PCBA, SMT, and electronic assembly processes.
• Self-motivated with the ability to work effectively in a cross‑functional team.

Responsibilities

• Serve as the SME for PCB manufacturing and electronic assembly processes.
• Lead, manage and mentor engineering teams for productivity and process optimization.
• Apply Six Sigma and Lean principles to enhance production quality.

Skills

Process engineering

Six Sigma

Lean methodologies

Project management

Communication skills

Education

Bachelor’s degree in Electrical, Chemical, Mechanical, Industrial Engineering or a related field

Job description

As a Senior NPI / Process Engineer, you will serve as the Subject Matter Expert (SME) for PCB manufacturing and electronic assembly processes. You will lead, mentor and guide engineering teams to enhance process performance, efficiency and product quality across manufacturing operations. This role requires a seasoned technical leader with deep expertise in process engineering, Six Sigma/Lean methodologies, and New Product Introduction (NPI). You will drive continuous improvement, ensure superior quality standards and collaborate closely with both customer and supplier teams.

Key Responsibilities

• Serve as the SME for all PCB manufacturing and electronic assembly processes, providing expert-level guidance across global teams.
• Lead, manage and mentor engineering teams to drive productivity, process optimization and manufacturing excellence.
• Manage complex projects to develop, analyze and improve manufacturing processes, improving efficiency and quality.
• Apply Six Sigma and Lean Manufacturing principles to reduce costs and enhance production quality.
• Design and execute process Design of Experiments (DOEs) to evaluate and optimize key process parameters.
• Oversee facility layout and assembly flow optimization to ensure efficient production operations.
• Implement process improvements, including tooling, material, and method validation for new and existing products.
• Lead and mentor teams in Design for Manufacturability (DFM) and New Product Introductions (NPIs), ensuring smooth transitions from prototype to production.
• Conduct lessons learned reviews post-NPI and drive corrective actions for continuous improvement.
• Collaborate with Quality and Manufacturing Engineering to address customer issues, perform Root Cause Analysis (RCA) and implement Corrective Actions (CA).
• Act as the technical point of contact for customers regarding process-related technical support.
• Demonstrate a strong understanding of solder paste stencil design and application best practices.
• Lead process improvement and new process development projects, driving scalable solutions into production.
• Mentor and develop Process Engineering personnel, providing technical leadership and guidance.
• Drive continuous improvement initiatives across products and sites to enhance overall manufacturing performance.
• Ensure compliance with the Quality Management System (QMS) and all applicable regulatory standards.

Requirements

• Onsite role (remote or hybrid not available).
• Bachelor’s degree in Electrical, Chemical, Mechanical, Industrial Engineering or a related field.
• Minimum 7-10 years’ experience in electronics manufacturing, process engineering, or a related technical discipline.
• Strong knowledge of PCBA, SMT, and electronic assembly processes.
• Proven ability to lead teams, manage complex projects, and drive continuous improvement initiatives.
• Excellent communication skills and high attention to detail.
• Self-motivated with the ability to work effectively in a cross‑functional team environment.

Preferred Experience

• Lead‑free materials and soldering technologies
• High‑density interconnect (HDI) and micro‑via technologies
• Manual and robotic soldering processes (including BGA rework)
• Tooling and fixture design
• Epoxy and corner‑bonding applications
• Manual and automated conformal coating processes

Job status: Full‑time, direct hire
Base pay range: $100k - $110k/year

Foxconn Assembly, LLC is an Equal Opportunity Employer (EOE). All qualified candidates will receive consideration without regard to race, color, religion, gender, sexual orientation, national origin, age, disability, or marital status in accordance with applicable federal, state, and local laws.

Foxconn Assembly, LLC participates in E‑Verify and will provide the federal government with your Form I‑9 information to confirm your authorization to work in the U.S.