Shape how Rockwell Automation builds electronics—one board at a timePicture your day starting on the production floor in Mequon, walking a new SMT line start-up, then heading to New Berlin to finalize a capital plan for selective solder upgrades. In between, you’re advising a global site on solder-print optimization and reviewing design-for-assembly feedback with hardware engineers. That’s the rhythm of this role: hands-on problem solving, standard-setting leadership, and technology stewardship across Rockwell Automation’s global electronic assembly operations.Based within our specialized Manufacturing Process Engineering – PCBA team, you’ll operate at the intersection of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis. You’ll report to the Manager of Manufacturing Process Engineering – PCBA and spend significant on-site time at our Mequon and New Berlin facilities while influencing sites worldwide.MissionProvide expert leadership in electronic assembly to elevate quality, reliability, and throughput—and deliver long-term profitability—through global standardization, strategic capital deployment, and technology innovation.What you’ll ownTechnical depth: Maintain deep expertise in at least two electronic assembly domains such as Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick-and-place, SMT reflow, AOI, and equipment maintenance & troubleshooting.Standards leadership: Create, deploy, and sustain global process standards that reduce cost, improve quality, and increase throughput; author and maintain procedures, work instructions, and training materials; drive best-practice adoption across global facilities.Capital & technology: Lead equipment selection, business case development, purchasing, and implementation; manage capital projects from requirements through production release; benchmark emerging technologies via suppliers, conferences, and technical forums; assess facilities against standardized criteria.Data-driven optimization: Use DOE, control charts, and statistical analysis; monitor and report electronic assembly KPIs; apply Lean Six Sigma methodologies (DMAIC and DMADV) to drive continuous improvement.Design engagement: Partner with design on DFM/DFA; embed assembly considerations into Electronic Assembly Design Guidelines; share knowledge via presentations, documentation, and technical reviews.Required qualificationsBachelor's degree in a relevant field.Significant on-site presence at Mequon and New Berlin, with global collaboration across Rockwell Automation facilities.Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job openingPreferred qualificationsTypically 8+ years of relevant experience.BS or MS in Mechanical, Electrical, or Industrial Engineering.7–10+ years of hands-on electronic assembly manufacturing experience.Depth in solder profiling, SMT, post‑SMT, or conformal coat processes.Familiarity with IPC‑A‑610.Lean Six Sigma experience (Green Belt or higher preferred).Tools and methods you knowBachelor's Degree5 Why (Root Cause Analysis Method)ISO 22000Process EngineeringDesign for Assembly (DFA)Electrical / Electronic SystemsEngineering DegreeAS9100 ExperienceIf you thrive on building standards, scaling best practices globally, and extracting measurable improvements from complex assembly processes, you’ll feel right at home here.