Patterning & Dry Etch Process Development Engineer

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 134,000 - 255,000; Full time

Job summary

Intel Corporation in Oregon's Hillsboro area is seeking an experienced Module Development Engineer to advance next-generation dry etch and patterning processes. You will join Intel Logic Technology Development and work with cross-functional teams to deliver scalable solutions.

The role emphasizes hands-on process development, DOE studies, and technology transfer to manufacturing, with a clear path to impact device performance and yield.

Qualifications

• PhD or Master's/Bachelor's with relevant research and industry experience.
• Hands-on dry etch process development and optimization experience.
• Experience with plasma etch fundamentals and defect mechanisms.
• Experience delivering dry etch solutions that improve yield and reliability.

Responsibilities

• Drive development of next-generation patterning processes and qualification methods.
• Plan experiments (DOE/response surface) and analyze results to improve yield.
• Mentor engineers and communicate status/risks to stakeholders.
• Collaborate with cross-functional teams to transfer processes to manufacturing.

Skills

Statistical analysis

DOE methodologies

Cross-functional collaboration

Problem solving

Education

PhD in Chemical Engineering / related field

Master's degree in Chemical Engineering / related field

Bachelor's degree in Chemical Engineering / related field

Tools

JMP

Python

MATLAB

Job description

Intel Corporation in Oregon's Hillsboro area is seeking an experienced Module Development Engineer to advance next-generation dry etch and patterning processes. You will join Intel Logic Technology Development and work with cross-functional teams to deliver scalable solutions.

The role emphasizes hands-on process development, DOE studies, and technology transfer to manufacturing, with a clear path to impact device performance and yield.