Packaging & Silicon Photonics Engineer (New Grad)

GlobalFoundries inc.; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Benefits offered by this job

Mentorship program

Training opportunities

Travel up to 10%

Competitive salary

Job summary

GlobalFoundries seeks a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support development and manufacturing of electro-optical transceivers on GF’s Photonix platform and advanced packaging technologies.

The role covers package integration, process development, reliability characterization, and data analysis, offering hands-on experience in silicon photonics and

Qualifications

• GPA 3.0 or higher in an accredited degree program.
• STEM field as listed in education qualifications.
• Experience analyzing engineering data.
• Ability to work effectively in cross-functional teams.
• English language proficiency (written & verbal).

Responsibilities

• Support assembly process integration for silicon photonics and advanced packaging products.
• Assist with process development, characterization, and qualification activities for new package technologies.
• Analyze engineering data to identify process improvements.
• Participate in failure analysis and root cause investigations.
• Collaborate with design, product, manufacturing, quality, and supplier teams.

Skills

Analytical skills

Cross-functional teamwork

Data analysis

English fluency

Education

STEM degree (Bachelors/Masters/PhD) in Materials Science, Mechanical, Electrical, Chemical or Physics

Tools

DOE methodologies

Statistical data tools

Job description

GlobalFoundries seeks a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross-functional teams to support development and manufacturing of electro-optical transceivers on GF’s Photonix platform and advanced packaging technologies.

The role covers package integration, process development, reliability characterization, and data analysis, offering hands-on experience in silicon photonics and