Packaging Engineering Intern: Learn & Build

Skyworks Solutions, Inc.; Greensboro (NC); On-site; USD 40,000 - 68,000; Full time

Job summary

Skyworks Solutions, Inc. seeks a Packaging Engineering Intern in Greensboro, NC. This internship offers real work experience, mentoring by industry experts, and opportunities for future full-time roles.

Projects span technology development, design rules, and assembly processes, with hands-on exposure to semiconductor manufacturing. Candidates should be pursuing a bachelor’s, master’s, or PhD in a relevant field, have a 3.0 GPA or higher, and possess strong communication and analytical skills.

Qualifications

• BS in Materials Science or Mechanical Engineering.
• Mechanical/Materials Engineering skills.
• Communication and presentation skills.
• Ability to manage and drive problem resolution.
• Demonstrate strong analytical thinking skills.
• 3.0 GPA or higher.
• Background with packaging materials (theoretical/practical).
• Background with assembly process (theoretical/practical).
• Experience using simulation software (ANSYS, COMSOL, SolidWorks Simulation) preferred.
• Familiarity with automating simulation tasks using scripting or macros preferred.

Responsibilities

• Learn about Technology Development project methodologies to help and improve the process.
• Learn about Design Rules and Assembly Process; foster mentoring.
• Review Assembly and Marking diagrams and look for opportunities to improve.
• Material and BOM review and support of project deployment.
• Onsite hands-on learning in semiconductor assembly processes.
• Other minor activities related to documentation and continuous improvement (A3 documentation as part of Lean).

Skills

Mechanical/Materials engineering

Communication and presentation

Problem resolution

Analytical thinking

GPA 3.0+

Education

BS in Materials Science or Mechanical Engineering

Tools

ANSYS

COMSOL

SolidWorks Simulation

Job description

Skyworks Solutions, Inc. seeks a Packaging Engineering Intern in Greensboro, NC. This internship offers real work experience, mentoring by industry experts, and opportunities for future full-time roles.

Projects span technology development, design rules, and assembly processes, with hands-on exposure to semiconductor manufacturing. Candidates should be pursuing a bachelor’s, master’s, or PhD in a relevant field, have a 3.0 GPA or higher, and possess strong communication and analytical skills.