Packaging Engineering Intern - Hands-on Semiconductors

Qorvo, Inc.; Greensboro (NC); On-site; USD 43,000 - 58,000; Part time

Job summary

Qorvo, Inc. in Greensboro, NC invites a Packaging Engineering Intern to learn through hands-on projects in semiconductor assembly.

You will engage with Technology Development workflows, review design rules, and support material and BOM activities while contributing to continuous improvement. The internship targets BS candidates in Materials Science or Mechanical Engineering, with interest in packaging materials and assembly processes.

Qualifications

• Background with packaging materials (theoretical or practical).
• Background with assembly process (theoretical or practical).
• Experience using simulation software (i.e. ANSYS, COMSOL, SolidWorks).
• Familiarity with automating simulation tasks using scripting or macros is preferred.
• Communication and presentation skills.
• Ability to manage and drive problem resolution.
• 3.0 GPA or higher.

Responsibilities

• Learn about Technology Development projects methodologies to help and improve the process.
• Learn about Design Rules and Assembly Process — Foster and mentoring.
• Review Assembly and Marking diagram — look for opportunities to improve.
• Material and BOM review and support of project deployment.
• Onsite hands-on learning in semiconductor assembly processes.
• Other minor activities related to documentation and continuous improvement (i.e. A3 documentation as part of Lean).

Skills

Materials Science

Mechanical Engineering

Packaging materials

Assembly process

Simulation software

Scripting/macros

Communication skills

Analytical thinking

Education

BS in Materials Science

BS in Mechanical Engineering

Tools

ANSYS

COMSOL

SolidWorks Simulation

Job description

Qorvo, Inc. in Greensboro, NC invites a Packaging Engineering Intern to learn through hands-on projects in semiconductor assembly.

You will engage with Technology Development workflows, review design rules, and support material and BOM activities while contributing to continuous improvement. The internship targets BS candidates in Materials Science or Mechanical Engineering, with interest in packaging materials and assembly processes.