Packaging Engineering Intern: Hands-on Semiconductors

Skyworks Solutions, Inc; Greensboro (NC); On-site; USD 40,000 - 68,000; Full time

Benefits offered by this job

Mentoring

Launch & Learn

Networking events

Final presentation

Job summary

Skyworks Solutions, Inc. is seeking a Packaging Engineering Intern in Greensboro to work on advanced packaging and substrate technology development projects within the Technology & Manufacturing group. You will gain hands-on experience, understand design rules and manufacturing processes, and contribute to process improvement.

The internship offers mentoring from industry experts, learning opportunities, and a path to full-time opportunities. A 3.0 GPA and strong analytical skills are preferred.

Qualifications

• BS in Materials Science, Chemical, Mechanical, or Electrical Engineering.
• Mechanical/Material/Chemical/Electrical Engineering skills.
• Communication and presentation skills.
• Ability to manage and drive problem resolution.
• Demonstrate strong analytical thinking skills.
• 3.0 GPA or higher.

Responsibilities

• Learn about Advanced Packaging and Substrate Technology Development projects methodologies - to help and improve the process.
• Learn about Substrate Design Rules and Manufacturing Processes - Foster and mentoring.
• Review Assembly and Marking diagram - look for opportunities to improve.
• Plan and execute Design of Experiments in support of project deployment.
• Onsite hands‑on learning semiconductor assembly processes -
• Other minor activities related to documentation and continuous improvement (A3s - Lean)

Skills

Communication and presentation skills

Analytical thinking

Problem resolution

Education

BS in Materials Science, Chemical, Mechanical, or Electrical Engineering

Tools

Altium

KiCAD

Job description

Skyworks Solutions, Inc. is seeking a Packaging Engineering Intern in Greensboro to work on advanced packaging and substrate technology development projects within the Technology & Manufacturing group. You will gain hands-on experience, understand design rules and manufacturing processes, and contribute to process improvement.

The internship offers mentoring from industry experts, learning opportunities, and a path to full-time opportunities. A 3.0 GPA and strong analytical skills are preferred.