Packaging Eng Intern: Hands-On Semiconductors

Skyworks Solutions, Inc.; Greensboro (NC); On-site; USD 40,000 - 68,000; Full time

Job summary

Skyworks Solutions, Inc. offers an Internship Program designed for college students enrolled in accredited bachelor’s, master’s, or PhD programs. You will gain real work experience, exposure to upper management, and potential full-time opportunities as available.

The Packaging Engineering Internships are part of the Technology & Manufacturing group. Projects are determined by business needs and not eligible for visa sponsorship. Onsite learning, mentoring, and networking events are provided.

Qualifications

• BS in Materials Science or Mechanical Engineering with strong academic record.
• Strong communication and presentation abilities are required.
• Ability to manage and drive problem resolution with analytical thinking.
• Minimum 3.0 GPA.

Responsibilities

• Learn Technology Development project methodologies to support improvement.
• Study Design Rules and Assembly processes; assist mentoring.
• Review Assembly and Marking diagrams to identify improvements.
• Support material and BOM review for project deployment.
• Hands-on onsite learning in semiconductor assembly processes.
• Assist with documentation and Lean tools like A3 reports.

Skills

Mechanical/Materials engineering

Communication skills

Presentation skills

Problem solving

Analytical thinking

GPA 3.0 or higher

Education

BS in Materials Science or Mechanical Engineering

Tools

ANSYS

COMSOL

SolidWorks Simulation

Scripting/macros

Job description

Skyworks Solutions, Inc. offers an Internship Program designed for college students enrolled in accredited bachelor’s, master’s, or PhD programs. You will gain real work experience, exposure to upper management, and potential full-time opportunities as available.

The Packaging Engineering Internships are part of the Technology & Manufacturing group. Projects are determined by business needs and not eligible for visa sponsorship. Onsite learning, mentoring, and networking events are provided.