Packaging Engineer

TechDoQuest; Hampton (VA); On-site; USD 110,000 - 150,000; Full time

Job summary

Onite seeks an experienced Electromechanical Packaging Engineer to lead packaging design for high-power-density electronic assemblies used in professional power tools. The role integrates electrical interconnects, antennas, sensors, and batteries into compact, reliable packages suited for harsh environments.

The ideal candidate has 6+ years in electromechanical packaging, deep knowledge of DFA/DFS, EMI/EMC, and 3D CAD proficiency (Creo/SolidWorks/NX).

Qualifications

• Bachelor's degree in Mechanical, Electrical, Electromechanical Engineering or related discipline.
• 6+ years in electromechanical packaging or related product development roles.
• Experience packaging high-power electronic systems in compact, space-constrained products.
• Strong knowledge of wire harness design, connector systems, and electrical interconnect architectures.
• Experience with DFA/DFS, regulatory compliance, and product certification activities.

Responsibilities

• Lead the electromechanical packaging design of high-power-density assemblies for professional tools.
• Develop packaging architectures for power electronics, motor controls, battery interfaces, RF systems, sensors, and modules.
• Design and optimize electrical interconnect systems (busbars, high-current connectors, PCB-to-PCB/wire interfaces).
• Create packaging solutions for harsh environments (shock, vibration, ingress, chemicals).
• Drive DFA and DFS to reduce manufacturing complexity, time, and cost.
• Collaborate with manufacturing to validate production readiness and processes.

Skills

Power electronics packaging

3D CAD

DFA/DFS

EMI/EMC grounding

Electrical interconnects

Thermal management

Cross-functional collaboration

Education

Bachelor's degree in Mechanical/Electrical/Electromechanical Engineering

Tools

Creo

SolidWorks

NX

PCB tools

Job description

Job Title: Electromechanical Packaging Engineer

Location: Hampton, VA

Onite

Experience: 5-10 Years

Position Summary

We are seeking an experienced Electromechanical Packaging Engineer to lead the design and development of electrical and mechanical packaging solutions for next-generation high-performance power tool systems and power electronics platforms. This role will focus on the integration of high-power-density electronics, electrical interconnects, antennas, sensors, batteries, and electromechanical components into compact, highly reliable products operating in harsh environments.

The ideal candidate will possess deep expertise in power electronics packaging, wire harness and electrical interconnect design, environmental protection, shock and vibration durability, regulatory compliance, design for assembly (DFA), and design for serviceability (DFS). This individual will work closely with electrical, mechanical, manufacturing, quality, and sourcing teams to develop robust and scalable product architectures from concept through production.

Key Responsibilities:

• Lead the electromechanical packaging design of high-power-density electronic assemblies for professional and industrial power tool applications.
• Develop packaging architectures for power electronics, motor controls, battery interfaces, RF systems, sensors, and communication modules.
• Design and optimize electrical interconnect systems including:
  • Busbars
  • High-current connectors
  • PCB-to-PCB and PCB-to-wire interfaces
  • Grounding and shielding solutions
• Develop packaging solutions capable of surviving demanding operating conditions including:
  • High shock and vibration
  • Dust and water ingress
  • Chemical exposure
  • Long-life cyclic loading environments
• Drive Design for Assembly (DFA) initiatives to reduce manufacturing complexity, assembly time, and product cost.
• Drive Design for Serviceability (DFS) to improve field repairability, maintenance access, and product lifecycle support.
• Collaborate with manufacturing teams to develop efficient assembly processes and validate production readiness.
• Define environmental sealing strategies including gaskets, overmolding, potting, conformal coating, and enclosure designs to achieve required IP ratings.
• Partner with electrical engineering teams to ensure robust solutions for:
  • EMI/EMC compliance
  • ESD protection
  • Grounding strategies
• Support packaging and placement of wireless communication systems, antennas, and RF components to optimize signal performance.
• Conduct tolerance analyses, thermal studies, and packaging trade‑off evaluations.
• Support DFMEA, PFMEA, design reviews, and root cause investigations.
• Interface with suppliers and manufacturing partners to develop scalable, cost-effective solutions.
• Ensure designs comply with applicable global regulatory and product safety requirements.

Required Qualifications

• Bachelor's degree in Mechanical Engineering, Electrical Engineering, Electromechanical Engineering, or related technical discipline.
• Minimum 6 years of experience in electromechanical packaging, power electronics packaging, or related product development roles.
• Proven experience packaging high-power electronic systems in compact, space‑constrained products.
• Strong knowledge of wire harness design, connector systems, and electrical interconnect architectures.
• Shock and vibration durability
• Environmental sealing and protection
• High-current applications
• Harsh operating environments
• Demonstrated application of Design for Assembly (DFA) and Design for Serviceability (DFS) principles.
• Working knowledge of EMI, EMC, grounding, shielding, and ESD mitigation techniques.
• Experience supporting regulatory compliance and product certification activities.
• Proficiency with 3D CAD tools such as Creo, SolidWorks, NX, or equivalent.
• Experience collaborating across mechanical, electrical, manufacturing, and quality engineering disciplines.

Preferred Qualifications:

• Experience in the power tool, outdoor power equipment, industrial equipment, battery systems, or portable power industries.
• Experience packaging:
  • Battery management systems (BMS)
  • High-current battery interfaces
• Knowledge of RF packaging and antenna integration for Bluetooth®, Wi-Fi, UWB, cellular, or other wireless communication systems.
• Familiarity with thermal management solutions for high-power-density electronics.
• Experience with UL, IEC, CE, FCC, CSA, and other global compliance requirements.
• Knowledge of IP‑rated enclosure design and environmental qualification testing.
• Familiarity with reliability engineering methodologies and accelerated life testing.

Success Factors:

The successful candidate will be a highly collaborative engineer who can balance performance, reliability, manufacturability, serviceability, cost, and regulatory requirements while developing robust packaging solutions for next‑generation professional power products. The individual must be comfortable working in a fast‑paced innovation environment and driving technical decisions across multiple engineering disciplines.