Mechanical Engineer

Dover Corporation; Salisbury (MD); On-site; USD 85,000 - 125,000; Full time

Job summary

Dover Corporation seeks an engineer to design electro-mechanical packaging for RF devices, using CAD to tackle packaging, thermal, and stress challenges in enclosures.

You will perform thermal and mechanical analyses, create drawings and BOMs, and support root-cause investigations and customer interactions. Strong CAD skills and MIL-STD familiarity are essential.

Qualifications

• Experience in thermal and structural analysis for electro-mechanical packaging.
• NASTRAN or equivalent thermal/structural analysis software.
• Proficiency with CAD tools (Inventor/AutoCAD) required.
• Experience with PCB layout software.
• RF microwave experience and circuitry knowledge.
• Knowledge of MIL-STD testing.
• Excellent written and verbal communication skills.

Responsibilities

• Design high-performance mechanical assemblies for RF devices.
• Analyze thermal, mechanical stress and vibration in enclosures.
• Perform air flow calculations for cooling designs.
• Create detailed drawings and BOMs; manage ECOs.
• Support root-cause analysis of mechanical failures.
• Collaborate with customers and internal teams.

Skills

Thermal analysis

Structural analysis

Electro-mechanical packaging

RF assembly design

NASTRAN

Education

B.S. Mechanical Eng

M.S. Mechanical Eng

Tools

AutoDesk Inventor

AutoCAD

PCB layout software

Job description

Position Overview

Primarily responsible for the design efforts for electro-mechanical packaging for radio frequency (RF) devices. Position utilizes CAD to design, evaluate, and solve packaging, thermal, and stress challenges related to the assembly of electronic hardware within standard and custom designed enclosures.

Job Duties/Responsibilities

• Design high performance mechanical assemblies and support production of designs by production teams
  • Design mechanical structures that house circuit card assemblies, electronic components, subassemblies, etc.
  • Conduct the thermal, mechanical stress, and vibration analysis of electro-mechanical enclosures, heat exchange mechanisms, and printed circuit boards used on airborne, maritime, and ground-mobile RF equipment
  • Conduct air flow calculations to determine mass flow (lb/min), volume flow, velocity, pressure drop, etc., with ambient, inlet, and outlet variables such as temperature, altitude, and pressure
  • Designs and develops PCB's and PCBA's IAW IPC-2221.
• Produce and maintain the documentation related to the mechanical aspects of a design
  • Develop detail drawings and Bills of Materials (BOM) for assigned product designs
  • Incorporate engineering change orders
• Support research and investigation to determine the root cause analysis of mechanical failures
• Support new program proposal efforts including technical interchange with potential customers
• Support and aid in the development of multiple mechanical designers

Knowledge, Skills, And Abilities

• Experience in thermal and structural analysis, and electro-mechanical packaging required, NASTRAN is preferred
• Experience using thermal and stress analysis software is required
  • AutoDesk Inventor and AutoCAD preferred
• Experience with PCB layout software.
• RF Microwave experience and experience with passive and active circuitry.
• General knowledge of MIL-STD testing is required
  • Knowledge of Airborne Mil environments preferred
• Knowledge of thermal and mechanical test equipment preferred
• Knowledge of IPC standards preferred
• Must have excellent written and verbal skills
• Must be able to effectively and efficiently communicate with other departments, including manufacturing, quality and management
• Must be able to communicate effectively with the customer (both internal and external), both in verbal and written formats

Requirements

• Must be a US Person (US Citizen or permanent resident - green card holder)
• Bachelor's degree in mechanical engineering from an accredited four-year college or university and 2+ years of relevant experience OR MS in mechanical engineering from an accredited college or university and 3+ years of relevant experience
• Experience with 3D CAD software required
• Experience with military standards and specifications required
• Experience with military electro-mechanical enclosure designs highly desired
• ISO and lean manufacturing experience highly desired
• Ability to obtain a DoD security clearance
• Works from minimal documentation, written or verbal instructions, schematics, rough sketches, diagrams, and layouts.