Packaging Design Engineer – Data Center Hardware (Equity)

Google LLC; Sunnyvale (CA); On-site; USD 159,000 - 230,000; Full time

Job summary

Google is seeking a Product Design Engineer in Sunnyvale, CA, to design and evaluate data center systems, identifying product requirements and supporting research and project planning. The role emphasizes scalable architecture from chip to chiller and cross-functional collaboration with global teams.

Responsibilities include creating 3D CAD models and drawings, coordinating packaging design with Product, Manufacturing, Quality, and Logistics, and ensuring ISTA/ASTM testing compliance.

Qualifications

• Bachelor's degree or equivalent in Mechanical Engineering, Product Design, or related field.
• 5 years of packaging design experience for hardware or consumer goods.
• Experience with ISTA and ASTM D4169 protocols.
• Experience using CAD tools (Creo, NX, Solidworks).
• Master's degree in Packaging or Mechanical Engineering (preferred).
• Certified Packaging Professional (CPP) credential (preferred).
• 8 years leading NP I packaging programs with global packaging and logistics providers (preferred).
• Experience with TOPS, CAPE, and FEA simulation tools (preferred).

Responsibilities

• Design and evaluate data center systems, identifying product requirements and contributing to research and project planning.
• Prepare system-related documentation and contribute to architecture scaling from chip to chiller.
• Collaborate cross-functionally with Product, Manufacturing, Quality, and Logistics teams.

Skills

Packaging design

ISTA/ASTM experience

Education

Bachelor's degree in Mechanical Engineering or related field

Master's degree in Packaging Engineering or Mechanical Engineering

CPP credential

Tools

Creo

NX

Solidworks

FEA tools

Job description

Google is seeking a Product Design Engineer in Sunnyvale, CA, to design and evaluate data center systems, identifying product requirements and supporting research and project planning. The role emphasizes scalable architecture from chip to chiller and cross-functional collaboration with global teams.

Responsibilities include creating 3D CAD models and drawings, coordinating packaging design with Product, Manufacturing, Quality, and Logistics, and ensuring ISTA/ASTM testing compliance.