Package Design Engineer

Broadcom

San Jose (CA)

On-site

USD 141,300 - 226,000

Full time

14 days+

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Benefits offered by this job

Competitive salary
Discretionary annual bonus
Comprehensive benefits package
401(K) with company matching

Job summary

A leading semiconductor company in San Jose is looking for an experienced IC package-design engineer. You will design complex flip-chip-BGA packages for ASICs used in AI, networking, and HPC. This role requires managing multiple projects, focusing on signal integrity, and collaborating with a global team. A minimum of 12 years experience in package design is required, with knowledge of Cadence tools preferred. The position is full-time and on-site.

Qualifications

  • 12+ years of experience in flip-chip-BGA package design.
  • Knowledge in package-level signal integrity and power integrity.
  • Experience with Cadence SKILL or similar design-automation coding.

Responsibilities

  • Design ASIC package with focus on signal and power integrity.
  • Manage multiple design projects simultaneously.
  • Collaborate with team for design processes and efficiency improvements.

Skills

Signal integrity
Power integrity
Project management
Self-management
Organization skills

Education

BSEE or MSEE

Tools

Cadence APD

Job description

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Job Description:

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
  • Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
  • Schedule, prioritize, & track your work across 2+ projects simultaneously
  • General flip-chip BGA package design & engineering
  • Project management and customer interface for your design projects
  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
  • Physical design (layout) is a foundational responsibility in this role


EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years’ work experience
  • Knowledge of package-level signal integrity and power integrity, to apply to package designs
  • Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
  • Self-management and organization skills
  • Preferred candidates will also have1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the Broadcom office, 5-days a week. This is not a remote-work position

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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