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Package Design Engineer

Broadcom

Austin (TX)

On-site

USD 107,000 - 190,000

Full time

30+ days ago

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Job summary

An established industry player is seeking a skilled package design engineer to join their innovative R&D team. This role involves designing complex flip-chip-BGA packages for cutting-edge ASICs utilized in AI, networking, and 5G technologies. You will be responsible for ensuring signal integrity and manufacturability while collaborating with a global team. The position offers a competitive salary and comprehensive benefits, including medical, dental, and 401(K) matching. If you have a passion for high-performance design and want to make a significant impact in the tech industry, this opportunity is perfect for you.

Benefits

Medical, dental and vision plans
401(K) participation with company matching
Employee Stock Purchase Program (ESPP)
Paid sick leave
Vacation time
Company paid holidays
Employee Assistance Program (EAP)

Qualifications

  • 8+ years in flip-chip-BGA package design, including high-speed SerDes.
  • Knowledge of package-level signal integrity and power integrity.

Responsibilities

  • Design responsibility for ASIC package designs focusing on signal and power integrity.
  • Manage multiple projects and contribute to design efficiency improvements.

Skills

Flip-Chip BGA Package Design
Signal Integrity
Power Integrity
Project Management
Cadence SKILL
Design Automation

Education

BSEE or similar field
MSEE or similar field

Tools

Cadence APD (Allegro Package Designer)

Job description

Job Description:

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  1. Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
  2. 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest (3 or more years is preferred).
  3. Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
  4. Schedule, prioritize, & track your work across 2+ projects simultaneously.
  5. General flip-chip BGA package design & engineering.
  6. Project management and customer interface for your design projects.
  7. Contribute to efficiency improvements for the design.

EDUCATION/EXPERIENCE & REQUIREMENTS:

  1. BSEE or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes.
  2. Knowledge of package-level signal integrity and power integrity, to apply to package designs.
  3. Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.
  4. Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
  5. Self-management and organization skills.

Compensation and Benefits:

The annual base salary range for this position is $107,000 - $190,000. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Equal Opportunity Employer: Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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