Package Architecture Analyst

Intel; Hillsboro (OR); Hybrid; USD 191,000 - 269,000; Full time

Job summary

Intel in Hillsboro, OR is seeking a Silicon Packaging Architect to design end-to-end package solutions meeting electrical, mechanical, thermal, and cost targets. You will oversee packaging development from design to production readiness and collaborate across silicon, hardware, and manufacturing teams.

Ideal candidates bring 9+ years in semiconductor packaging or 6+ with a relevant master's, strong DFM/DOE experience, and proven problem-solving skills.

Qualifications

• Bachelor's degree in mechanical, electrical, or materials science and related field.
• 9+ years hands-on packaging experience.
• Master's degree with 6+ years of hands-on experience.
• PhD with 4+ years of hands-on experience in relevant field.

Responsibilities

• Translate product requirements into detailed package architecture specs.
• Lead trade-off decisions to meet electrical, mechanical, thermal, and reliability targets.
• Collaborate with silicon, hardware, and package leads to deliver outputs and remove roadblocks.
• Oversee packaging development from design to production readiness and drive process improvements.
• Apply expertise to troubleshoot designs and deliver cost-effective solutions.
• Partner with manufacturing for smooth design-to-production transitions and tape-out support.
• Apply DFM principles to optimize manufacturability and production efficiency.
• Maintain and refine technical documentation for development processes.

Skills

Semiconductor packaging architectures

Design for Manufacturing (DFM)

Design of Experiments (DOE)

Troubleshooting package design

Education

Bachelor's degree Mechanical Engineering, Electrical Engineering, Materials Science or related field

Master's degree in a relevant field

PhD in a relevant field

Job description

Job Details

Job Description: As a Silicon Packaging Architect, you will play a pivotal role in designing and driving end-to-end package solutions that meet physical, electrical, and cost requirements while ensuring high-quality output. You will oversee the complete packaging development process, from design through production readiness, resolving technical challenges and delivering innovative, cost-effective solutions. Your expertise in package architecture will contribute directly to Intel's success by enabling seamless integration of silicon and hardware technologies.

Business group

You will be part of a dynamic organization focused on delivering cutting-edge packaging solutions that align with Intel's broader innovation goals. This team works collaboratively across silicon, hardware, and manufacturing domains to ensure that Intel's products meet stringent performance, reliability, and quality standards. Together, the group contributes to Intel's leadership in advanced semiconductor packaging technologies, enabling the creation of world-class products.

Key Responsibilities

• Translate product requirements into detailed package architecture specifications.
• Lead technology trade-off decisions ensuring packaging solutions meet electrical, mechanical, thermal, and reliability standards.
• Collaborate with silicon, hardware, and package leads to deliver high-quality package outputs and address roadblocks.
• Oversee the packaging development process, including design, processes, and procedures, while driving continuous improvement in packaging quality standards.
• Apply expertise in troubleshooting package designs, resolving technical issues, and delivering innovative, cost-effective solutions.
• Partner with manufacturing teams to ensure seamless design-to-production transitions and support tape-out readiness.
• Utilize Design for Manufacturing (DFM) principles to optimize package designs for manufacturability and production efficiency.
• Maintain and refine technical documentation to support package development processes.

Behavioral traits

• Excellent analytical, communication, and problem-solving skills to influence and drive results effectively.
• Collaborate cross-functionally with diverse teams in silicon, hardware, and manufacturing domains.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications

• Bachelor's degree Mechanical Engineering, Electrical Engineering, Materials Science or related field with 9+ years of hands-on experience OR a Master's degree in a relevant field with 6+ years of hands-on experience OR a PhD in a relevant field with 4+ years of hands-on experience
• 4+ years of experience in:
• Defining semiconductor/electronic package architectures and developing technical documentation.
• Experience applying Design for Manufacturing (DFM) principles
• Utilizing Design of Experiments (DOE) methodologies
• Troubleshooting package design and manufacturing issues

Preferred Qualifications

• Advanced understanding of semiconductor packaging technologies and industry trends.
• Experience leading cross-disciplinary teams in a technical environment.

We invite you to join us in shaping the future of technology by applying your expertise in cutting-edge packaging solutions. Be part of a dynamic team that thrives on innovation and collaboration, and contribute to creating a lasting impact in the world of semiconductor technology.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $190,610.00 - 269,100.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.