Optoelectronic Wire Bonding Technician

Lehigh Heavy Forge Corporation; Salem (NH); On-site; USD 25,000 - 39,000; Full time

Job summary

GPD Optoelectronics in Salem, NH is seeking a Wire Bonder to join our cleanroom manufacturing team. You will perform wire bonding of chips to ceramic substrates and packages, prep materials, and operate bond equipment per work instructions.

You will also inspect assemblies under a microscope to MIL STD-883 criteria, conduct basic electrical tests, document results in our ERP system, and help maintain traceability and cleanroom discipline.

Qualifications

• High School / GED or Technical trade school required or equivalent.
• 2–3 years' experience in manufacturing or technical environment preferred.
• Wire bonding experience highly desired in microelectronics/optoelectronics.

Responsibilities

• Perform manual and semi-automatic wire bonding of chips to ceramic substrates and packages.
• Inspect assemblies under a microscope to MIL STD-883 workmanship criteria.
• Conduct basic electrical go/no-go testing using standard fixtures and equipment.
• Document nonconforming material or process issues and maintain production records.

Skills

Wire bonding

Microscope handling

Manual dexterity

Attention to detail

Education

High School / GED or Technical trade school

Tools

ERP system

Job description

GPD Optoelectronics in Salem, NH is seeking a Wire Bonder to join our cleanroom manufacturing team. You will perform wire bonding of chips to ceramic substrates and packages, prep materials, and operate bond equipment per work instructions.

You will also inspect assemblies under a microscope to MIL STD-883 criteria, conduct basic electrical tests, document results in our ERP system, and help maintain traceability and cleanroom discipline.