Optical MEMS Packaging Lead — Unlimited Vacation

Omnitron Sensors; Santa Clara (CA); On-site; USD 130,000 - 190,000; Full time

Benefits offered by this job

Competitive salary and equity

Medical/dental/vision insurance

Unlimited vacation

Professional development reimbursement

Visa sponsorship and support

Job summary

Omnitron Sensors in Santa Clara, CA, seeks a Senior Packaging Engineer to lead MEMS packaging design for high-volume production. You will develop FEA models to predict sensor behavior due to packaging, and design experiments to drive development activities.

You will collaborate with suppliers and internal teams to improve packaging solutions and ensure reliability. The role requires a BS/MS in Mechanical, Chemical, or Materials Science Engineering with 5–10 years in MEMS/optical MEMS packaging,

Qualifications

• BS/MS degree in Mechanical, Chemical, or Materials Science Engineering.
• 5–10 years of industrial MEMS/optical MEMS packaging experience.
• Experience with CLCC, LGA, CSP packages and high-volume IC/MEMS assembly.
• FEA modeling experience with practical stress reduction solutions.
• Hands-on layout tools: AutoCAD, SolidWorks, Altium.
• Knowledge of optical MEMS sensors and failure analysis.
• Six Sigma Green Belt certification.

Responsibilities

• Lead MEMS packaging design for high-volume manufacturing.
• Develop FEA models to predict sensor behavior from packaging.
• Create and analyze DOEs for development activities.
• Support process integration, yield, DFx, and reliability.
• Coordinate with U.S. and international suppliers to improve packaging.
• Manage material logistics for experimental needs.

Skills

MEMS packaging design

FEA modeling

DOE development and analysis

Cross-site collaboration

Leadership & technical coordination

Six Sigma Green Belt

Technical communication

Education

BS/MS in Mechanical, Chemical, or Materials Science Engineering

Tools

AutoCAD

SolidWorks

Altium

Job description

Omnitron Sensors in Santa Clara, CA, seeks a Senior Packaging Engineer to lead MEMS packaging design for high-volume production. You will develop FEA models to predict sensor behavior due to packaging, and design experiments to drive development activities.

You will collaborate with suppliers and internal teams to improve packaging solutions and ensure reliability. The role requires a BS/MS in Mechanical, Chemical, or Materials Science Engineering with 5–10 years in MEMS/optical MEMS packaging,