Senior Electro Optics Packaging Engineer

APIC CORPORATION

Culver City (CA)

On-site

USD 115,000 - 130,000

Full time

14 days+

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Benefits offered by this job

Competitive compensation

Comprehensive benefits

Job summary

A leading technology firm based in Culver City, California, is seeking a Senior Electro-Optics Packaging Engineer. This role involves leading the design of high-performance optical modules and collaborating with teams to ensure production readiness. The ideal candidate has over 10 years of experience in optical packaging and is proficient in SolidWorks and ANSYS. This position offers a competitive salary range of $115,000 to $130,000 and comprehensive benefits, contributing to innovative technologies with a national security impact.

Qualifications

10+ years in optical, optoelectronic, or IC packaging and assembly.
Hands-on experience with fiber alignment tools and wire bonding.
Proficiency with SolidWorks and FEA tools.

Responsibilities

Lead mechanical and opto-mechanical design of EO modules.
Architect packaging solutions for optoelectronic and IC assemblies.
Perform structural and thermal simulations using ANSYS and SolidWorks.
Ensure compliance with JEDEC and MIL-STD requirements.

Skills

Optical, optoelectronic, or IC packaging expertise

Mechanical design

Precision alignment systems

Fiber alignment tools

Reliability engineering

Education

BS in Mechanical Engineering, Electrical Engineering, Physics

MS or PhD preferred

Tools

SolidWorks

ANSYS

COMSOL

Job description

APIC Corporation—an industry pioneer in advanced photonics since 1999—is shaping the future of high‑performance computing and AI. Our Heterogeneously Integrated Photonics and Electronics (HIP‑E) platform fuses photonically connected chiplets with next‑generation advanced packaging to deliver unmatched bandwidth, energy efficiency, and low‑latency interconnects for dual‑use commercial and defense systems. For more information, refer to our website: https://www.apichip.com/hip-e/

We’re expanding our engineering team with a Senior Electro‑Optics Packaging Engineer who will lead the mechanical development of next‑generation integrated optical modules.

If you thrive at the intersection of precision engineering, advanced materials, and mission‑critical reliability, this role puts you at the center of breakthrough innovation.

What You’ll Do

Lead mechanical and opto‑mechanical design of compact, high‑performance EO modules
Architect packaging solutions for optoelectronic and IC assemblies (fiber alignment, wire bonding, flip‑chip, 3D packaging)
Perform structural, thermal, and coupled‑physics simulations using ANSYS, COMSOL, and SolidWorks
Ensure micro‑radian alignment stability under dynamic thermal, shock, and vibration environments
Conduct material property analysis, yield improvement, and failure‑mode investigations
Collaborate with photonics, electronics, reliability, and manufacturing teams to deliver production‑ready hardware
Ensure compliance with JEDEC, EIA, Telcordia, and MIL‑STD requirements

What You Bring

10+ years in optical, optoelectronic, or IC packaging and assembly
Expertise in optical bench design and precision alignment systems
Hands‑on experience with fiber alignment tools, wire bonding, flip‑chip bonding, and fiber packaging
Strong background in microelectronics, optoelectronics packaging, and low‑outgassing adhesive systems
Proficiency with SolidWorks and FEA tools (ANSYS required)
Knowledge of materials, multilayer interfaces, BGA/PCBA/Flex reliability, and 3D packaging
Familiarity with DOE, SPC, Six Sigma, and reliability engineering methodologies
U.S. Citizenship or Permanent Residency (ITAR‑restricted programs)

Education