Onsite Entry-Level Quantum Hardware Assembly & R&D Engineer

IBM

Town of Yorktown (NY)

On-site

USD 85,000 - 160,000

Full time

14 days+

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Job summary

IBM Quantum invites applications for an Associate Quantum Hardware Assembly R&D Engineer in Yorktown Heights, NY. This on-site role focuses on developing advanced electronic packaging for superconducting qubit systems, with close collaboration with scientists and engineers.

You will work on SMT, die attach, flip-chip assembly, and related packaging techniques, while growing technically in a multidisciplinary environment.

Qualifications

Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.
Strong troubleshooting and collaboration abilities.
Growth mindset with eagerness to learn and develop new skills.

Responsibilities

Develop and optimize assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip‑chip assembly, and related packaging techniques.
Evaluating assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.
Supporting hardware integration, process troubleshooting, and root‑cause investigations to resolve assembly and packaging‑related issues.
Documenting experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.
Collaborating with multidisciplinary teams across IBM Quantum to support hardware development, integration, and technology maturation efforts.