Associate Quantum Hardware Assembly R&D Engineer

IBM

Town of Yorktown (NY)

On-site

USD 85,000 - 160,000

Full time

6 days ago
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Job summary

IBM Quantum invites applications for an Associate Quantum Hardware Assembly R&D Engineer in Yorktown Heights, NY. This on-site role focuses on developing advanced electronic packaging for superconducting qubit systems, with close collaboration with scientists and engineers.

You will work on SMT, die attach, flip-chip assembly, and related packaging techniques, while growing technically in a multidisciplinary environment.

Qualifications

  • Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.
  • Strong troubleshooting and collaboration abilities.
  • Growth mindset with eagerness to learn and develop new skills.

Responsibilities

  • Develop and optimize assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip‑chip assembly, and related packaging techniques.
  • Evaluating assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.
  • Supporting hardware integration, process troubleshooting, and root‑cause investigations to resolve assembly and packaging‑related issues.
  • Documenting experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.
  • Collaborating with multidisciplinary teams across IBM Quantum to support hardware development, integration, and technology maturation efforts.

Skills

Troubleshooting
Teamwork
Attention to detail
Growth mindset

Education

Bachelor's Degree in a related technical field

Tools

SMT
Die attach
Flip‑chip assembly

Job description

IBM Quantum is seeking a motivated Associate Quantum Hardware Assembly R&D Engineer to join the Quantum Hardware team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. This entry-level role offers an exciting opportunity to develop advanced electronic packaging technologies for next-generation quantum computing systems.

The ideal candidate is a collaborative team player with strong attention to detail, a strong growth mindset, and a passion for hands‑on engineering and experimentation. Working alongside world‑class scientists and engineers, you will use state‑of‑the‑art assembly and characterization tools to develop new hardware, processes, and packaging technologies for superconducting qubit systems. Prior experience with quantum hardware is not required. We are looking for candidates with a strong technical foundation, a willingness to learn, and enthusiasm for solving challenging engineering problems. This is a fully on‑site position.

Your role and responsibilities

Key Responsibilities

As an Associate Quantum Hardware Assembly R&D Engineer, you will support the research, development, fabrication, and characterization of advanced electronic packaging technologies for quantum hardware.

Responsibilities include:

  • Developing and optimizing assembly processes for next-generation quantum devices, including surface mount technology (SMT), die attach, flip‑chip assembly, and related packaging techniques.
  • Evaluating assembly yields, process capability, and package performance through electrical, mechanical, and physical characterization methods.
  • Supporting hardware integration, process troubleshooting, and root‑cause investigations to resolve assembly and packaging‑related issues.
  • Documenting experimental methods, results, and recommendations through technical reports, presentations, and formal documentation.
  • Collaborating with multidisciplinary teams across IBM Quantum to support hardware development, integration, and technology maturation efforts.

Required education

Bachelor's Degree

Preferred education

Bachelor's Degree

Required technical and professional expertise

Required Professional and Technical Expertise

  • Ability to independently troubleshoot and solve complex technical problems.
  • Ability to work effectively with interdisciplinary teams, including electrical engineers, fabrication engineers, materials scientists, and experimental physicists.
  • Strong growth mindset with a desire to continuously learn and develop new skills.
  • Strong attention to detail and commitment to high‑quality work.

Required Education

  • Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, or a related technical field.

Preferred Qualifications

  • Academic, internship, or research experience involving materials development, characterization, or process engineering.

Bonus Qualifications

  • Hands‑on experience with electronic packaging and assembly techniques, including die attach, flip‑chip assembly, surface mount technology (SMT), soldering, or related processes.
  • Experience with optical microscopy, SEM, cross‑sectioning, metrology, and basic electrical testing.
  • Familiarity with process development, statistical process control, yield analysis, or design‑of‑experiments (DOE) methodologies.
ABOUT BUSINESS UNIT

IBM Research is the organic growth engine of IBM and an innovation engine for our customers and partners. As part of this mission, IBM Research anticipates and examines 'What's Next in Computing' to ultimately create and integrate the technologies the world relies upon to solve big challenges and unlock new opportunities. We create and pioneer new markets for IBM, our partners and customers as exemplified in our ongoing quest to reach practical and large‑scale quantum computing. Across IBM Research, we realize the power and potential to accelerate discovery with our partners and clients by combining the power of high performance computing, AI, and Quantum, all integrated through the hybrid cloud.

YOUR LIFE @ IBM

In a world where technology never stands still, we understand that, dedication to our clients success, innovation that matters, and trust and personal responsibility in all our relationships, lives in what we do as IBMers as we strive to be the catalyst that makes the world work better.

Being an IBMer means you’ll be able to learn and develop yourself and your career, you’ll be encouraged to be courageous and experiment everyday, all whilst having continuous trust and support in an environment where everyone can thrive whatever their personal or professional background.

Our IBMers are growth minded, always staying curious, open to feedback and learning new information and skills to constantly transform themselves and our company. They are trusted to provide on‑going feedback to help other IBMers grow, as well as collaborate with colleagues keeping in mind a team focused approach to include different perspectives to drive exceptional outcomes for our customers. The courage our IBMers have to make critical decisions everyday is essential to IBM becoming the catalyst for progress, always embracing challenges with resources they have to hand, a can‑do attitude and always striving for an outcome focused approach within everything that they do.

Are you ready to be an IBMer?

ABOUT IBM

IBM’s greatest invention is the IBMer. We believe that through the application of intelligence, reason and science, we can improve business, society and the human condition, bringing the power of an open hybrid cloud and AI strategy to life for our clients and partners around the world.

Restlessly reinventing since 1911, we are not only one of the largest corporate organizations in the world, we’re also one of the biggest technology and consulting employers, with many of the Fortune 500 companies relying on the IBM Cloud to run their business.

At IBM, we pride ourselves on being an early adopter of artificial intelligence, quantum computing and blockchain. Now it’s time for you to join us on our journey to being a responsible technology innovator and a force for good in the world.

IBM is proud to be an equal‑opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, genetics, pregnancy, disability, neurodivergence, age, or other characteristics protected by the applicable law. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.

OTHER RELEVANT JOB DETAILS

IBM offers a competitive and comprehensive benefits program. Eligible employees may have access to:

  • Healthcare benefits including medical & prescription drug coverage, dental, vision, and mental health & well being
  • Financial programs such as 401(k), cash balance pension plan, the IBM Employee Stock Purchase Plan, financial counseling, life insurance, short & long‑term disability coverage, and opportunities for performance based salary incentive programs
  • Generous paid time off including 12 holidays, minimum 56 hours sick time, 120 hours vacation, 12 weeks parental bonding leave in accordance with IBM Policy, and other Paid Care Leave programs. IBM also offers paid family leave benefits to eligible employees where required by applicable law
  • Training and educational resources on our personalized, AI‑driven learning platform where IBMers can grow skills and obtain industry‑recognised certifications to achieve their career goals
  • Diverse and inclusive employee resource groups, giving & volunteer opportunities, and discounts on retail products, services & experiences

We consider qualified applicants with criminal histories, consistent with applicable law.

This position was posted on the date cited in the key job details section and is anticipated to remain posted for 21 days from this date or less if not needed to fill the role.

IBM will not be providing visa sponsorship for this position now or in the future. Therefore, in order to be considered for this position, you must have the ability to work without a need for current or future visa sponsorship.

The compensation range and benefits for this position are based on a full‑time schedule for a full calendar year. The salary will vary depending on your job‑related skills, experience and location. Pay increment and frequency of pay will be in accordance with employment classification and applicable laws. For part time roles, your compensation and benefits will be adjusted to reflect your hours. Benefits may be pro‑rated for those who start working during the calendar year.

Job Title

Associate Quantum Hardware Assembly R&D Engineer

Date posted

28‑Aug‑2026

Job ID

130456

City / Township / Village

Yorktown Heights

State / Province

New York

Country

United States

Work arrangement

Onsite

Area of work

Infrastructure & Technology

Employment type

Regular

Contract type

Regular

Projected Minimum Salary per year

85,000.00

Projected Maximum Salary per year

160,000.00

Position type

Entry Level

No Travel

Company

(0147) International Business Machines Corporation

Shift

General (daytime)

Is this role a commissionable/sales incentive based position?

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