Microelectronics Process Engineer - High-Reliability Assembly

Metasys Technologies; Los Angeles (CA); On-site; USD 110,000 - 170,000; Full time

Job summary

Metasys Technologies is seeking a hands-on Microelectronics Manufacturing/Process Engineer to support, troubleshoot, and improve high-reliability microelectronics and electronic assembly processes. The role emphasizes epoxy dispensing, die attach, wire bonding, and related testing within a regulated manufacturing environment.

The ideal candidate will have experience in aerospace/defense or similarly regulated settings, with familiarity in MIL-STD-883 and MIL-PRF requirements.

Qualifications

• Hands-on experience in high-reliability microelectronics manufacturing.
• Experience with epoxy dispensing, die attach, wire bonding, and wire-bond pull testing.
• Familiarity with MIL-STD-883, MIL-PRF-38534/38535, Class H/K requirements is a plus.

Responsibilities

• Develop, troubleshoot, and optimize microelectronics and hybrid assembly manufacturing processes.
• Support process qualification, validation, and implementation of new microelectronic assembly processes.
• Collaborate with Production, Engineering, Quality, and Supply Chain to reduce defects and improve yields.

Skills

Microelectronics

Hybrid assembly

Die attach

Epoxy dispensing

Wire bonding

Process optimization

Root-cause analysis

QA/Regulatory

Education

Bachelor's degree in Engineering/Science

Job description

Metasys Technologies is seeking a hands-on Microelectronics Manufacturing/Process Engineer to support, troubleshoot, and improve high-reliability microelectronics and electronic assembly processes. The role emphasizes epoxy dispensing, die attach, wire bonding, and related testing within a regulated manufacturing environment.

The ideal candidate will have experience in aerospace/defense or similarly regulated settings, with familiarity in MIL-STD-883 and MIL-PRF requirements.