Microelectronics Assembler: Die Attach & Wire Bonding

Teledyne Technologies Incorporated; Lewisburg (KY); On-site; USD 42,000 - 54,000; Full time

Benefits offered by this job

Competitive pay

Comprehensive benefits

Growth opportunities

Collaborative culture

Job summary

Teledyne HiRel, a division of Teledyne Technologies Incorporated, designs and manufactures advanced microelectronic solutions for mission-critical aerospace, defense, and industrial markets. The Microelectronics Manufacturing Assembler will be part of a team ensuring precision and reliability in every component we deliver.

The role requires interpreting blueprints, assembling hybrid circuits and ICs, and operating specialized equipment in a cleanroom environment while adhering to ESD and ITAR

Qualifications

• Strong manual dexterity and attention to detail.
• Proficiency in fine-pitch soldering and component placement.
• Experience with substrate technologies (thick/thin film).
• Familiarity with epoxy dispensing and curing.
• 2–4 years in microelectronic assembly or semiconductor manufacturing.
• High school diploma or equivalent; technical certifications in electronics/microelectronics preferred.
• Ability to work in a cleanroom environment and follow strict protocols.
• Must be a U.S. person due to ITAR requirements.

Responsibilities

• Assemble microelectronic components such as hybrid circuits and integrated circuits with exceptional accuracy.
• Perform die attach, wire bonding (ball, wedge, ribbon), and surface-mount assembly under magnification.
• Interpret engineering blueprints, schematics, and technical drawings to guide assembly processes.
• Operate specialized equipment including automated wire bonders and eutectic die attach systems.
• Maintain cleanroom standards and contamination control procedures.
• Follow Electrostatic Discharge (ESD) protocols to protect sensitive components.

Skills

Manual dexterity

Fine-pitch soldering

Component placement

Cleanroom procedures

Blueprint interpretation

ESD compliance

ITAR awareness

Education

High school diploma or equivalent

Technical certifications in electronics/microelectronics

Tools

Die attach equipment

Wire bonding equipment

Epoxy dispensing systems

Job description

Teledyne HiRel, a division of Teledyne Technologies Incorporated, designs and manufactures advanced microelectronic solutions for mission-critical aerospace, defense, and industrial markets. The Microelectronics Manufacturing Assembler will be part of a team ensuring precision and reliability in every component we deliver.

The role requires interpreting blueprints, assembling hybrid circuits and ICs, and operating specialized equipment in a cleanroom environment while adhering to ESD and ITAR